2013

Advanced Thermal Management Materials

Authors:

ISBN: 978-1-4614-1962-4 (Print) 978-1-4614-1963-1 (Online)

Table of contents (10 chapters)

  1. Front Matter

    Pages i-xi

  2. No Access

    Book Chapter

    Pages 1-10

    Introduction to Thermal Management in Microelectronics Packaging

  3. No Access

    Book Chapter

    Pages 11-28

    Requirements of Thermal Management Materials

  4. No Access

    Book Chapter

    Pages 29-44

    Overview of Traditional Thermal Management Materials

  5. No Access

    Book Chapter

    Pages 45-71

    Development of Advanced Thermal Management Materials

  6. No Access

    Book Chapter

    Pages 73-87

    Properties of WCu, MoCu, and Cu/MoCu/Cu High-performance Heat Sink Materials and Manufacturing Technologies

  7. No Access

    Book Chapter

    Pages 89-98

    Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications

  8. No Access

    Book Chapter

    Pages 99-107

    Improved Manufacturing Process of Cu/Mo70-Cu/Cu Composite Heat Sinks for Electronic Packaging Applications

  9. No Access

    Book Chapter

    Pages 109-122

    AlSiC Thermal Management Materials

  10. No Access

    Book Chapter

    Pages 123-140

    Understanding Lasers, Laser Diodes, Laser Diode Packaging and Their Relationship to Tungsten Copper

  11. No Access

    Book Chapter

    Pages 141-149

    Future Trend of Advanced Thermal Management Materials

  12. Back Matter

    Pages 151-154