Advanced Materials for Thermal Management of Electronic Packaging

Authors:

ISBN: 978-1-4419-7758-8 (Print) 978-1-4419-7759-5 (Online)

Table of contents (12 chapters)

  1. Front Matter

    Pages i-xxi

  2. No Access

    Book Chapter

    Pages 1-58

    Thermal Management Fundamentals and Design Guides in Electronic Packaging

  3. No Access

    Book Chapter

    Pages 59-129

    Characterization Methodologies of Thermal Management Materials

  4. No Access

    Book Chapter

    Pages 131-167

    Electronic Packaging Materials and Their Functions in Thermal Managements

  5. No Access

    Book Chapter

    Pages 169-200

    Monolithic Carbonaceous Materials and Carbon Matrix Composites

  6. No Access

    Book Chapter

    Pages 201-232

    Thermally Conductive Polymer Matrix Composites

  7. No Access

    Book Chapter

    Pages 233-276

    High Thermal Conductivity Metal Matrix Composites

  8. No Access

    Book Chapter

    Pages 277-304

    Thermally Conductive Ceramic Matrix Composites

  9. No Access

    Book Chapter

    Pages 305-371

    Thermal Interface Materials in Electronic Packaging

  10. No Access

    Book Chapter

    Pages 373-420

    Materials and Design for Advanced Heat Spreader and Air Cooling Heat Sinks

  11. No Access

    Book Chapter

    Pages 421-475

    Liquid Cooling Devices and Their Materials Selection

  12. No Access

    Book Chapter

    Pages 477-525

    Thermoelectric Cooling Through Thermoelectric Materials

  13. No Access

    Book Chapter

    Pages 527-593

    Development and Application of Advanced Thermal Management Materials

  14. Back Matter

    Pages 595-616