3D Integration for NoC-based SoC Architectures

Editors:

ISBN: 978-1-4419-7617-8 (Print) 978-1-4419-7618-5 (Online)

Table of contents (11 chapters)

  1. Front Matter

    Pages 1-1

  2. 3DI Promises and Challenges

    1. Front Matter

      Pages 1-1

    2. No Access

      Book Chapter

      Pages 3-26

      Three-Dimensional Integration of Integrated Circuits—an Introduction

    3. No Access

      Book Chapter

      Pages 27-44

      The Promises and Limitations of 3-D Integration

  3. Technology and Circuit Design

    1. Front Matter

      Pages 45-45

    2. No Access

      Book Chapter

      Pages 47-74

      Testing 3D Stacked ICs Containing Through-Silicon Vias

    3. No Access

      Book Chapter

      Pages 75-88

      Design and Computer Aided Design of 3DIC

    4. No Access

      Book Chapter

      Pages 89-114

      Physical Analysis of NoC Topologies for 3-D Integrated Systems

    5. No Access

      Book Chapter

      Pages 115-145

      Three-Dimensional Networks-on-Chip: Performance Evaluation

  4. System and Architecture Design

    1. Front Matter

      Pages 147-147

    2. No Access

      Book Chapter

      Pages 149-165

      Asynchronous 3D-NoCs Making Use of Serialized Vertical Links

    3. No Access

      Book Chapter

      Pages 167-191

      Design of Application-Specific 3D Networks-on-Chip Architectures

    4. No Access

      Book Chapter

      Pages 193-223

      3D Network on Chip Topology Synthesis: Designing Custom Topologies for Chip Stacks

    5. No Access

      Book Chapter

      Pages 225-248

      3-D NoC on Inductive Wireless Interconnect

    6. No Access

      Book Chapter

      Pages 249-271

      Influence of Stacked 3D Memory/Cache Architectures on GPUs

  5. Back Matter

    Pages 266-266