Coupled Data Communication Techniques for High-Performance and Low-Power Computing

Editors:

ISBN: 978-1-4419-6587-5 (Print) 978-1-4419-6588-2 (Online)

Table of contents (8 chapters)

  1. Front Matter

    Pages i-xvi

  2. Introduction

    1. Front Matter

      Pages 1-1

    2. No Access

      Book Chapter

      Pages 3-10

      Introduction to Coupled Data Technologies

  3. Overview of 3D Technologies

    1. Front Matter

      Pages 12-12

    2. No Access

      Book Chapter

      Pages 13-48

      Power delivery, signaling and cooling for 2D and 3D integrated systems

  4. Coupled Data Technologies

    1. Front Matter

      Pages 50-50

    2. No Access

      Book Chapter

      Pages 51-77

      Capacitive Coupled Communication

    3. No Access

      Book Chapter

      Pages 79-125

      Inductive Coupled Communications

    4. No Access

      Book Chapter

      Pages 127-153

      Use of AC Coupled Interconnect in Contactless Packaging

  5. Enabling Coupled Data Technologies

    1. Front Matter

      Pages 156-156

    2. No Access

      Book Chapter

      Pages 157-175

      Aligning chips face-to-face for dense capacitive communication

  6. Extending Data Coupling Technologies

    1. Front Matter

      Pages 178-178

    2. No Access

      Book Chapter

      Pages 179-192

      Delivering On-chip Bandwidth Off-chip and Out-of-box with Proximity and Optical Communication

    3. No Access

      Book Chapter

      Pages 193-204

      AC Coupled Wireless Power Delivery

  7. Back Matter

    Pages 205-206