2009

Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications

ISBN: 978-0-387-95867-5 (Print) 978-0-387-95868-2 (Online)

Table of contents (35 chapters)

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  1. Front Matter

    Pages i-xx

  2. Introduction

    1. Front Matter

      Pages 1-1

    2. No Access

      Book Chapter

      Pages 3-11

      Challenges in ULSI Interconnects - Introduction to the Book

  3. Technology Background

    1. Front Matter

      Pages 13-13

    2. No Access

      Book Chapter

      Pages 15-38

      MOS Device and Interconnects Scaling Physics

    3. No Access

      Book Chapter

      Pages 39-62

      Interconnects in ULSI Systems: Cu Interconnects Electrical Performance

    4. No Access

      Book Chapter

      Pages 63-71

      Electrodeposition

    5. No Access

      Book Chapter

      Pages 73-78

      Electrophoretic Deposition

    6. No Access

      Book Chapter

      Pages 79-90

      Wafer-Level 3D Integration for ULSI Interconnects

  4. Interconnect Materials

    1. Front Matter

      Pages 91-92

    2. No Access

      Book Chapter

      Pages 93-120

      Diffusion Barriers for Ultra-Large-Scale Integrated Copper Metallization

    3. No Access

      Book Chapter

      Pages 121-130

      Silicides

    4. No Access

      Book Chapter

      Pages 131-143

      Materials for ULSI metallization - Overview of Electrical Properties

    5. No Access

      Book Chapter

      Pages 145-151

      Low-κ Materials and Development Trends

    6. No Access

      Book Chapter

      Pages 153-167

      Electrical and Mechanical Characteristics of Air-Bridge Cu Interconnects

    7. No Access

      Book Chapter

      Pages 169-179

      ALD Seed Layers for Plating and Electroless Plating

  5. Deposition Processes for ULSI Interconnects

    1. Front Matter

      Pages 181-182

    2. No Access

      Book Chapter

      Pages 183-205

      Electrochemical Processes for ULSI Interconnects

    3. No Access

      Book Chapter

      Pages 207-220

      Atomic Layer Deposition (ALD) Processes for ULSI Manufacturing

    4. No Access

      Book Chapter

      Pages 221-235

      Electroless Deposition Approaching the Molecular Scale

  6. Modeling

    1. Front Matter

      Pages 237-237

    2. No Access

      Book Chapter

      Pages 239-253

      Modeling Superconformal Electrodeposition Using an Open Source PDE Solver

  7. Electrochemical Process Integration

    1. Front Matter

      Pages 255-256

    2. No Access

      Book Chapter

      Pages 257-261

      Introduction to Electrochemical Process Integration for Cu Interconnects

    3. No Access

      Book Chapter

      Pages 263-273

      Damascene Concept and Process Steps

    4. No Access

      Book Chapter

      Pages 275-298

      Advanced BEOL Technology Overview

    5. No Access

      Book Chapter

      Pages 299-310

      Lithography for Cu Damascene Fabrication

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