2009

Materials for Advanced Packaging

Editors:

ISBN: 978-0-387-78218-8 (Print) 978-0-387-78219-5 (Online)

Table of contents (19 chapters)

  1. Front Matter

    Pages i-xii

  2. No Access

    Book Chapter

    Pages 1-50

    3D Integration Technologies – An Overview

  3. No Access

    Book Chapter

    Pages 51-76

    Advanced Bonding/Joining Techniques

  4. No Access

    Book Chapter

    Pages 77-112

    Advanced Chip-to-Substrate Connections

  5. No Access

    Book Chapter

    Pages 113-179

    Advanced Wire Bonding Technology: Materials, Methods, and Testing

  6. No Access

    Book Chapter

    Pages 181-218

    Lead-Free Soldering

  7. No Access

    Book Chapter

    Pages 219-242

    Thin Die Production

  8. No Access

    Book Chapter

    Pages 243-271

    Advanced Substrates: A Materials and Processing Perspective

  9. No Access

    Book Chapter

    Pages 273-306

    Advanced Print Circuit Board Materials

  10. No Access

    Book Chapter

    Pages 307-337

    Flip-Chip Underfill: Materials, Process and Reliability

  11. No Access

    Book Chapter

    Pages 339-363

    Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips

  12. No Access

    Book Chapter

    Pages 365-405

    Electrically Conductive Adhesives (ECAs)

  13. No Access

    Book Chapter

    Pages 407-436

    Die Attach Adhesives and Films

  14. No Access

    Book Chapter

    Pages 437-458

    Thermal Interface Materials

  15. No Access

    Book Chapter

    Pages 459-502

    Embedded Passives

  16. No Access

    Book Chapter

    Pages 503-545

    Nanomaterials and Nanopackaging

  17. No Access

    Book Chapter

    Pages 547-600

    Wafer Level Chip Scale Packaging

  18. No Access

    Book Chapter

    Pages 601-627

    Microelectromechanical Systems and Packaging

  19. No Access

    Book Chapter

    Pages 629-680

    LED and Optical Device Packaging and Materials

  20. No Access

    Book Chapter

    Pages 681-712

    Digital Health and Bio-Medical Packaging

  21. Back Matter

    Pages 713-719