2007

Lead-Free Electronic Solders

A Special Issue of the Journal of Materials Science: Materials in Electronics

Authors:

ISBN: 978-0-387-48431-0 (Print) 978-0-387-48433-4 (Online)

Table of contents (23 chapters)

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  1. Front Matter

    Pages i-2

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    Book Chapter

    Pages 3-17

    Thermodynamics and phase diagrams of lead-free solder materials

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    Book Chapter

    Pages 19-37

    Phase diagrams of Pb-free solders and their related materials systems

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    Book Chapter

    Pages 39-54

    The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints

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    Book Chapter

    Pages 55-76

    Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications

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    Book Chapter

    Pages 77-91

    Rare-earth additions to lead-free electronic solders

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    Book Chapter

    Pages 93-119

    Compression stress-strain and creep properties of the 52In-48Sn and 97In-3Ag low-temperature Pb-free solders

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    Book Chapter

    Pages 121-127

    Sn-Zn low temperature solder

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    Book Chapter

    Pages 129-145

    Composite lead-free electronic solders

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    Book Chapter

    Pages 147-154

    Processing and material issues related to lead-free soldering

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    Book Chapter

    Pages 155-174

    Interfacial reaction issues for lead-free electronic solders

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    Book Chapter

    Pages 175-189

    Microstructure-based modeling of deformation in Sn-rich (Pb-free) solder alloys

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    Book Chapter

    Pages 191-210

    Deformation behavior of tin and some tin alloys

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    Book Chapter

    Pages 211-227

    Mechanical fatigue of Sn-rich Pb-free solder alloys

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    Book Chapter

    Pages 229-236

    Life expectancies of Pb-free SAC solder interconnects in electronic hardware

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    Book Chapter

    Pages 237-246

    Assessment of factors influencing thermomechanical fatigue behavior of Sn-based solder joints under severe service environments

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    Book Chapter

    Pages 247-258

    Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages

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    Book Chapter

    Pages 259-268

    Electromigration issues in lead-free solder joints

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    Book Chapter

    Pages 269-281

    Stress analysis of spontaneous Sn whisker growth

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    Book Chapter

    Pages 283-305

    Sn-whiskers: truths and myths

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    Book Chapter

    Pages 307-318

    Tin pest issues in lead-free electronic solders

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