Solder Joint Technology

Materials, Properties, and Reliability

Authors:

ISBN: 978-0-387-38890-8 (Print) 978-0-387-38892-2 (Online)

Table of contents (12 chapters)

  1. Front Matter

    Pages I-XVI

  2. Introduction

    1. No Access

      Book Chapter

      Pages 1-33

      Introduction

  3. Copper—Tin Reactions

    1. Front Matter

      Pages I-XVI

    2. No Access

      Book Chapter

      Pages 37-71

      Copper–Tin Reactions in Bulk Samples

    3. No Access

      Book Chapter

      Pages 73-109

      Copper–Tin Reactions in Thin-Film Samples

    4. No Access

      Book Chapter

      Pages 111-125

      Copper–Tin Reactions in Flip Chip Solder Joints

    5. No Access

      Book Chapter

      Pages 127-151

      Kinetic Analysis of Flux-Driven Ripening of Copper–Tin Scallops

    6. No Access

      Book Chapter

      Pages 153-181

      Spontaneous Tin Whisker Growth: Mechanism and Prevention

    7. No Access

      Book Chapter

      Pages 183-208

      Solder Reactions on Nickel, Palladium, and Gold

  4. Electromigration and Thermomigration

    1. Front Matter

      Pages I-XVI

    2. No Access

      Book Chapter

      Pages 211-243

      Fundamentals of Electromigration

    3. No Access

      Book Chapter

      Pages 245-288

      Electromigration in Flip Chip Solder Joints

    4. No Access

      Book Chapter

      Pages 289-303

      Polarity Effect of Electromigration on Solder Reactions

    5. No Access

      Book Chapter

      Pages 305-326

      Ductile–to-Brittle Transition of Solder Joints Affected by Copper–Tin Reaction and Electromigration

    6. No Access

      Book Chapter

      Pages 327-346

      Thermomigration

  5. Back Matter

    Pages 347-370