2007

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Editors:

ISBN: 978-0-387-27974-9 (Print) 978-0-387-32989-5 (Online)

Table of contents (45 chapters)

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  1. Materials Physics

    1. Front Matter

      Pages A1-A1

    2. No Access

      Book Chapter

      Pages A3-A63

      Polymer Materials Characterization, Modeling and Application

    3. No Access

      Book Chapter

      Pages A65-A110

      Thermo-Optic Effects in Polymer Bragg Gratings

    4. No Access

      Book Chapter

      Pages A111-A134

      Photorefractive Materials and Devices for Passive Components in WDM Systems

    5. No Access

      Book Chapter

      Pages A135-A180

      Thin Films for Microelectronics and Photonics: Physics, Mechanics, Characterization, and Reliability

    6. No Access

      Book Chapter

      Pages A181-A204

      Carbon Nanotube Based Interconnect Technology: Opportunities and Challenges

    7. No Access

      Book Chapter

      Pages A205-A266

      Virtual Thermo-Mechanical Prototyping of Microelectronics and Microsystems

  2. Materials Mechanics

    1. Front Matter

      Pages A267-A267

    2. No Access

      Book Chapter

      Pages A269-A281

      Fiber Optics Structural Mechanics and Nano-Technology Based New Generation of Fiber Coatings: Review and Extension

    3. No Access

      Book Chapter

      Pages A283-A312

      Area Array Technology for High Reliability Applications

    4. No Access

      Book Chapter

      Pages A313-A350

      Metallurgical Factors Behind the Reliability of High-Density Lead-Free Interconnections

    5. No Access

      Book Chapter

      Pages A351-A409

      Metallurgy, Processing and Reliability of Lead-Free Solder Joint Interconnections

    6. No Access

      Book Chapter

      Pages A411-A427

      Fatigue Life Assessment for Lead-Free Solder Joints

    7. No Access

      Book Chapter

      Pages A429-A458

      Lead-Free Solder Materials: Design For Reliability

    8. No Access

      Book Chapter

      Pages A459-A473

      Application of Moire Interferometry to Strain Analysis of PCB Deformations at Low Temperatures

    9. No Access

      Book Chapter

      Pages A475-A522

      Characterization of Stresses and Strains in Microelectronics and Photonics Devices Using Photomechanics Methods

    10. No Access

      Book Chapter

      Pages A523-A553

      Analysis of Reliability of IC Packages Using the Fracture Mechanics Approach

    11. No Access

      Book Chapter

      Pages A555-A570

      Dynamic Response of Micro- and Opto-Electronic Systems to Shocks and Vibrations: Review and Extension

    12. No Access

      Book Chapter

      Pages A571-A594

      Dynamic Physical Reliability in Application to Photonic Materials

    13. No Access

      Book Chapter

      Pages A595-A625

      High-Speed Tensile Testing of Optical Fibers— New Understanding for Reliability Prediction

    14. No Access

      Book Chapter

      Pages A627-A665

      The Effect of Temperature on the Microstructure Nonlinear Dynamics Behavior

    15. No Access

      Book Chapter

      Pages A667-A699

      Effect of Material’s Nonlinearity on the Mechanical Response of some Piezoelectric and Photonic Systems

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