Abstract
Thick film materials have proved to possess economic processing and functional advantages over other technologies in high-volume production of miniaturized circuits. The development of a low-cost fritless silver paste with different binder composition is described in the present work. The effect of composition and firing temperature (700–900 °C) on the microstructure is also reported. The sheet resistivity and surface morphology of all the indigenously formulated Ag thick film pastes are compared with the imported (ESL) paste. The results suggest that the thick films can be fired at 700 °C instead of the conventional 900 °C firing temperature.
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References
V. PURI, Hybrid Circuits 34 (1994) 28.
S. B. RANE and VIJAYA PURI, in Proceedings of the International Symposium on Emerging Microelectronics & Interconnection Technology (Bangalore, India, Feb. 1998) p. 395.
S. RANE and V. PURI, IETE Tech. Rev. 16 (1999) 129.
S. RANE, PhD Thesis, Shivaji University, Kolhapur, India (1999).
M. MANDHARE, S. GANGAL, M. SETTY and R. KAREKAR, Act. Passive Electron. Compon. 13 (1988) 45.
S. NISHIKI and S. YUKI, IEEE Trans. Microw. Theory Tech. MTT-30 7 (1982) 1104.
P. BARNWELL, J. WOOD and Q. REYNOLDS, in Proceedings of the International Symposium on Emerging Microelectronics and Interconnection Technology (Bangalore, India, Feb. 1998) p. 399.
J. C. LIN and C. Y. WANG, Mater. Chem. Phys. 45 (1996) 253.
S. RANE and V. PURI, Act. Passive Electron. Compon. (submitted) (March 2000).
C. Y. KUO, in Proceedings of ISHM (1987) p. 562.
B. E. TAYLOR, J. J. FELTEN and J. R. LARRY, IEEE Trans. Compon. Hybrid Manuf. Technol. CHMT-3 4 (1980) 504.
T. OGAWA, M. OOTANI, T. ASAI, M. HASEGAWA and O. ITO, ibid. 4 (1980) 504.
W. BORLAND, V. P. SINTA, Mater. Res. Soc. 108 (1988) 382.
W. SMETANA, and R. REICHER, in Proceedings of the Thirty third International Conference on Microelectronics. MIDEM-27 (1997) 260.
R. W. VEST, Materials Aspect of Thick Film Technology, ("Handbook of Electronics Ceramics") edited by R. C. Buchanan, NY, 1993 p. 443.
R. W. VEST, Ceram. Bull. 65 (1986) 435.
C. J. CHEN and J. M. WU, J. Mater. Res. 5 (1990) 1530.
M. ZHU and D. D. L. CHUNG, J. Electron. Mater. 23 (1994) 541.
A. ADABNIG, J. C. SCHUSTER, R. REICHER and W. SMETANA, J. Mater. Sci. 33 (1998) 4887.
C. PEYTOUR, F. BARBIER and A. REVEOLVESCHI, J. Mater. Res. 5 (1990) 127.
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Rane, S., Puri, V. & Amalnerkar, D. A study on sintering and microstructure development of fritless silver thick film conductors. Journal of Materials Science: Materials in Electronics 11, 667–674 (2000). https://doi.org/10.1023/A:1008914424013
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DOI: https://doi.org/10.1023/A:1008914424013