, Volume 11, Issue 9, pp 667-674

A study on sintering and microstructure development of fritless silver thick film conductors

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Thick film materials have proved to possess economic processing and functional advantages over other technologies in high-volume production of miniaturized circuits. The development of a low-cost fritless silver paste with different binder composition is described in the present work. The effect of composition and firing temperature (700–900 °C) on the microstructure is also reported. The sheet resistivity and surface morphology of all the indigenously formulated Ag thick film pastes are compared with the imported (ESL) paste. The results suggest that the thick films can be fired at 700 °C instead of the conventional 900 °C firing temperature.