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Development of processing windows for diffusion bonding of aluminium/magnesium dissimilar materials

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Abstract

This paper presents the procedures involved in constructing the diffusion bonding windows such as temperature–time and pressure–time diagrams for effective diffusion bonding of aluminium alloy and magnesium alloys. Empirical relationships were developed to predict the lap shear strength of diffusion bonded joints of aluminium (Al) alloy (AA6061) and magnesium (Mg) alloys (AZ31B, AZ61A, AZ80), incorporating diffusion bonding parameters such as bonding temperature, bonding pressure, holding time and surface roughness of the materials to be joined. Response surface methodology was applied to optimise the diffusion bonding parameters to attain the maximum shear strength of the joint. Relationship was established between weight percentage of Al content in Mg alloys and optimised diffusion bonding parameters. The developed processing windows can be used as reference maps to the design and welding engineers for selecting appropriate diffusion bonding parameters to get good quality bonds for Al and Mg alloys.

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Acknowledgments

The authors are grateful to the Department of Manufacturing Engineering, Annamalai University, Annamalai Nagar, India for extending the facilities of metal joining and Material Testing to carry out this investigation. The authors also wish to express their sincere thanks to Dr. S. Rajakumar, Assistant Professor, Dept. of Manufacturing Engineering, Annamalai University for helping in statistical analysis.

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Authors and Affiliations

  1. Center for Materials Joining and Research (CEMAJOR), Department of Manufacturing Engineering, Annamalai University, Annamalainagar, 608 002, Tamil Nadu, India

    V. Balasubramanian

  2. Department of Mechanical Engineering, Srinivasan Engineering College, Perambalur, 621 212, Tamil Nadu, India

    M. Joseph Fernandus

  3. Department of Mechanical Engineering, Anna University Chennai Tiruchirappalli Region, Tiruchirappalli, 620 024, Tamil Nadu, India

    T. Senthilkumar

Authors
  1. V. Balasubramanian
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  2. M. Joseph Fernandus
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  3. T. Senthilkumar
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Correspondence to V. Balasubramanian.

Additional information

Doc. IIW-2366, recommended for publication by Commission XVII “Brazing, Soldering, and Diffusion Bonding.”

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Balasubramanian, V., Fernandus, M.J. & Senthilkumar, T. Development of processing windows for diffusion bonding of aluminium/magnesium dissimilar materials. Weld World 57, 523–539 (2013). https://doi.org/10.1007/s40194-013-0048-0

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  • DOI: https://doi.org/10.1007/s40194-013-0048-0

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