Preparation of Cu nanoparticles-modified PA6 composites using CuO as filler

Abstract

This work focuses on the preparation of copper nanoparticles-modified polyamide 6 composites (denoted as nano-Cu/PA6) by in situ polymerization, with which cupric oxide as metallic copper source is directly reduced to metallic copper in the process of the opening-ring polymerization of ε-caprolactam only using the reducing atmosphere of reaction system. The obtained composites are characterized by means of transmission electron microscopy, X-ray diffraction, laser granulometry instrument, and ultraviolet–visible absorption spectroscopy. Moreover, the friction and wear resistance, mechanical strength, and antistatic performance of as-prepared composites are also readily evaluated. The results show that cupric oxide as filler is reduced to metallic copper and the as-reduced copper nanoparticles with 4–5-nm-size clusters separately disperse in polyamide 6 (PA6) matrix. Additionally, the addition content (mass fraction) of cupric oxide has significant effect on the crystalline form of PA6, and γ crystalline form of PA6 is predominant when higher dosage of CuO is introduced to fabricating nano-Cu/PA6 composites. Moreover, introducing a proper amount of CuO filler favors to generate nano-Cu/PA6 composites with improved mechanical properties and wear resistance. Particularly, nano-Cu/PA6 composite prepared at a CuO content of 0.5 % possesses the best tensile strength and wear resistance, showing promising application as a functional polymer–matrix composite.