, Volume 38, Issue 7, pp 1895-1902
Date: 13 Nov 2012

The Effect of the Grain Parameters on the Characterization of Polycrystalline CuS Films

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Abstract

Polycrystalline CuS film samples were prepared by spray pyrolysis technique using aqueous solutions of CuCl2 and SC(NH2)2, which were atomized with compressed air as carrier gas onto glass substrates at 250 °C. It is found that the resistivity of the polycrystalline films strongly depends on the grain parameters and temperature. The changes with annealing temperature are observed in the dislocation density, and strain related to the film grain size, grain boundary energy of the films, and the surface morphologies are discussed in detail.