Abstract
This paper reports on the effect of residual stress on the microcrack propagation of thin-film coated silicon wafers and the fracture toughness measurement using the micro indentation technique. Two types of silicon nitride films with different stress states, a high tensile vs. a low compressive stress, deposited by a LPCVD method were studied. It is found that a high tensile residual stress in the film leads to longer microcracks and a lower fracture toughness of silicon, while a compressive stress depresses the microcrack propagation and increases the toughness of silicon. To improve the mechanical performance of silicon devices, a slightly compressive stress in the film is suggested.
Similar content being viewed by others
References
Nix WD (1989) Mechanical properties of thin films. Metallurgical Trans A 20:2217–2245
Zhang S, Sun D, Fu Y, Du H (2005) Toughness measurement of thin films: a critical review. Surface & Coatings Tech 198:74–84
Morin P, Raymond G, Benoit D, Maury P, Beneyton R (2012) A comparison of the mechanical stability of silicon nitride films deposited with various techniques. Appl Surf Sci 260:69–72
Olson JM (2002) Analysis of LPCVD process conditions for the deposition of low stress silicon nitride. Part I: preliminary LPCVD experiments. Mater Sci Semicond Process 5:51–60
Evans AG, Charles EA (1976) Toughness determinations by indentation. J Am Ceram Soc 59:371–372
Lawn BR, Marshall DB (1979) Hardness, toughness brittleness; An indentation analysis. J Am Ceram Soc 62:347–350
Anstis GR, Chantikul P, Lawn BR, Marshall DB (1981) A critical evaluation of indentation techniques for measuring toughness: I - direct crack measurements. J Am Ceram Soc 64:533–538
Lawn BR, Evans AG, Marshall DB (1980) Elastic/plastic indentation damage in ceramics: The median / radial crack system. J Am Ceram Soc 63:574–581
King S, Chu R, Xu G, Huening J (2010) Intrinsic stress effect on fracture toughness of plasma enhanced chemical vapor deposited SiNx: H films. Thin Solid Films 518:4898–4907
Lawn BR, Cook RF (2012) Probing material properties with sharp indenters: a retrospective. J Mater Sci 47:1–22
Schuh CA (2006) Nanoindentation studies of materials. Mateiraltoday 9:32–40
Zeng K, Rowcliffe D (1994) Experimental measurement of residual stress field around a sharp indentation in glass. J Am Ceram Soc 77:524–530
Zeng K, Rowcliffe D (1995) Vickers indentations in glass – I. Residual stress fields and iso-stress contour maps. Acta Metal Mater 43:1935–1943
King SW, Gradner JA (2009) Intrinsic stress fracture energy measurements for PECVD thin films in the SiOxCyNz:H system. Microelectron Reliab 49:721–726
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Yang, C., Pham, J. On the Fracture Toughness Measurement of Thin Film Coated Silicon Wafers. Silicon 7, 27–30 (2015). https://doi.org/10.1007/s12633-014-9215-1
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s12633-014-9215-1