Abstract
In this work focussing on the thermal modeling of the automated tape placement process applied to thermoplastic material, we study the thermal properties of the ply interfaces during in-situ consolidation. Through the comparison of experimental measurements and numerical simulations, we show that it is necessary to consider the existence of an interply thermal contact resistance (TCR). Furthermore, we show that in order to correctly predict the measured temperatures, the value of the thermal resistance has to evolve along the process although a very simple evolution law is sufficient.
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References
Hamlyn A, Cartié D, Weber JP (2011) In: 32nd. International conference SEICO 11- New Material Characteristics to cover New Application Needs, Paris
Lukaszewicz DHJ, Ward C, Potter KD (2012) Compos: Part B 43:997
Schledjewski R (2009) Plast Rubber Compos 38(9–10):379
DeGennes P (1971) J Chem Phys 55:572
Tierney J, Gillespie J (2004) Compos Part A 35:547
Deslandes Y, Boudreau F (1990) J Mater Sci Lett 9:1274
Jonas A, Legras R (1991) Polymer 32(15):2691
Tierney J, Gillespie J (2006) J Compos Mater 40:1487
Pitchumani R, Ranganathan S, Don R, Gillespie J, Lamontia M (1996) Int J Heat Mass Transf 39(9):1883
Barasinski A, Leygue A, Soccard E, Poitou A (2010) AMPT2010
Levy A, Heider D, Tierney J, Gillespie J (2013) J Compos Constr. doi:10.1177/0021998313476318
Lamethe JF (2004) Etude de l’adhesion de composites thermoplastiques semi-cristallins; application à la mise en oeuvre par soudage. Ph.D. thesis, Universite Paris VI - Pierre et Marie Curie
Nicodeau C (2005) Modélisation du soudage en continu de composites à matrice thermoplastique. Ph.D. thesis, ENSAM Paris
Toso Y, Ermani P, Poulikakos D (2004) J Compos Mater 38(2):107
Ammar A, Mokdad B, Chinesta F, Keunings R (2006) J Non-Newtonian Fluid Mech 139:153
Bognet B, Ghnatios C, Barasinski A, Masson F, Chinesta F, Leygue A, Poitou A (2011) Rev Compos Mater Av 21(1):23
Bognet B, Bordeu F, Chinesta F, Leygue A, Poitou A (2012) Comput Methods Appl Mech Eng 201:1
Chinesta F, Leygue A, Bognet B, Ghnatios C, Poulhaon F, Bordeu F, Barasinski A, Poitou A, Chatel S, Maison-Le-Poec S (2012)
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Barasinski, A., Leygue, A., Soccard, E. et al. Identification of non uniform thermal contact resistance in automated tape placement process. Int J Mater Form 7, 479–486 (2014). https://doi.org/10.1007/s12289-013-1144-9
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DOI: https://doi.org/10.1007/s12289-013-1144-9