Research Article

Nano Research

, Volume 6, Issue 4, pp 263-268

Wafer scale direct-write of Ge and Si nanostructures with conducting stamps and a modified mask aligner

  • Hideki SatoAffiliated withDepartment of Materials Science and Engineering, University of WashingtonJapan Patent Office
  • , Stephanie E. VaskoAffiliated withDepartment of Materials Science and Engineering, University of WashingtonDepartment of Chemistry, University of Washington
  • , Marco RolandiAffiliated withDepartment of Materials Science and Engineering, University of Washington Email author 

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Abstract

The broad availability of high throughput nanostructure fabrication is essential for advancement in nanoscale science. Large-scale manufacturing developed by the semiconductor industry is often too resource-intensive for medium scale laboratory prototyping. We demonstrate the inexpensive wafer scale directwrite of Ge and Si nanostructures with a 4-inch mask aligner retrofitted with a conducting microstructured stamp. A bias applied between the stamp and an underlying silicon substrate results in the reaction of diphenylgermane and diphenylsilane precursors at the stamp-substrate interface to yield the directwrite of Ge and Si nanostructures in determined locations. With the increasing number of outdated mask aligners available from the semiconductor industry and an extensive library of liquid precursors, this strategy provides facile, inexpensive, wafer scale semiconductor direct-write for applications such as electronics, photonics, and photovoltaics.

Graphical abstract

http://static-content.springer.com/image/art%3A10.1007%2Fs12274-013-0302-1/MediaObjects/12274_2013_302_Fig1_HTML.gif

Keywords

Ge Si nanolithography microcontact printing scanning probe lithography