Skip to main content
Log in

Experiments and thermal-electrical analysis of buss bar and relay assemblies in junction blocks

  • Published:
International Journal of Automotive Technology Aims and scope Submit manuscript

Abstract

A junction block (or electrical distribution box) is electrical equipment that has been densely assembled from components such as buss bars, relays, and fuses to control the electric current flow in vehicles. Joule heat is generated in these parts as a result of electrical bulk resistance and electrical contact resistance. The generation of heat increases due to the complex behavior of modern vehicle electronic systems. Overheated parts can be damaged during operation due to thermal energy. The thermal assessment of a junction block is an important issue in automobile development. We suggest a methodology to simulate the transient temperature distribution of buss bars and electrical relays in a junction block. A finite element formulation of a coupled electro-thermal problem, which includes the effect of Joule heating, is introduced to the simulation. Finite element analysis (FEA) and experiments at the component level of buss bars and relays are conducted to investigate the thermal performance of a junction block. To verify the accuracy of the FEA procedure, the temperature history obtained by FEA is compared with the results obtained from experiments. The thermal-electric analysis of a typical junction block assembly is also discussed.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  • André, J., Antoni, L., Petit, J. P., Vito, E. D. and Montani, A. (2009). Electrical contact resistance between stainless steel bipolar plate and carbon felt in PEFC: A comprehensive study. Int. J. Hydrogen Energy 34,7, 3125–3133.

    Article  Google Scholar 

  • ANSYS (2006). Documentation-Theory Manual. Release 10.0. ANSYS Inc.

  • Antonova, E. E. and Looman, D. L. (2005). Finite elements for thermoelectric device analysis in ANSYS. ICT 2005 24th Int. Conf. Thermoelectrics, 215–218.

  • Bartel, A. and Feldmann, U. (2006). Modeling and simulation for thermal-electric coupling in an SOIcircuit. Mathematics in Industry, 9, 27–32.

    Article  Google Scholar 

  • Bouranta, K., Maleginnakis, G. A. and Kroplin, B. (1998). Thermo-electric-mechanical coupling problems solved by FE-formulation. Engineering Computations 15,6, 804–828.

    Article  MATH  Google Scholar 

  • Carvou, E., Abdi, R. E., Razafiarivelo, J., Benjemaa, N. and Zindine, E. M. (2012). Thermo-mechanical study of a power connector. Measurement 45,5, 889–896.

    Article  Google Scholar 

  • Doerstling, B. H. (1998). Thermal-electrical modeling of electrical subsystems. SAE Paper No. 981111, 1–7.

  • Greenwood, J. A. (1966). Constriction resistance and real area of contact. British J. Applied Physics, 17, 1621–1632.

    Article  Google Scholar 

  • Grujicic, M., Zhao, C. L. and Dusel, E. C. (2005). The effect of thermal contact resistance on heat management in the electronic packaging. Applied Surface Science 246,1–3, 290–302.

    Article  Google Scholar 

  • Holm, R. (1967). Electrical Contacts. 4th edn. Springer. New York.

    Google Scholar 

  • Incropera, F. P. and DeWitt, D. P. (2000). Introduction to Heat Transfer. John Willy & Sons. New York.

    Google Scholar 

  • Kogutm, L. and Komvopoulos, K. (2003). Electrical contact resistance theory for conductive rough surfaces. J. Applied Physics, 94, 3153–3162.

    Article  Google Scholar 

  • Korvink, J. G. and Rudyni, E. B. (2003). Computer-aided engineering of electro-thermal MST devices: Moving from devise to system simulations. Proc. EUROSIME’03, 4th Int. Conf. Thermal & Mechanical Simulation and Experiments in Micro-Electronics and Micro-systems.

  • Litke, P. J. (2002). Experimental Determination of Thermal Contact Conductance. M.S. Thesis. Purdue University. West Lafayette. Indiana.

    Google Scholar 

  • Mashimo, K., Saita, Y., Koizumi, K. and Nakazato, H. (2002). Heat transfer analysis for vehicle electronic parts. Furukawa Review, 22, 1–6.

    Google Scholar 

  • Preis, K., Biro, O., Edlinger, R. D. and Richter, K. R. (1994). Application of FEM to coupled electric, thermal and mechanical problems. IEEE Trans. 30,5, 3316–3319.

    Google Scholar 

  • Prume, K., Franken, K., Böttger, U., Waser, R. and Maier, H. R. (2002). Modelling and numerical simulation of the electrical, mechanical, and thermal coupled behaviour of multilayer capacitors (MLCs). J. European Ceramics Society, 22, 1285–1296.

    Article  Google Scholar 

  • Rao, V. V., Nagaraju, J. and Murthy, M. V. K. (2003). Thermal conductivity and thermal contact conductance studies on Al12 Si10wt. SiCp metal matrix composites. J. Composite Materials 37,19, 1713–1722.

    Article  Google Scholar 

  • Robertson, S. R. and Liao, K. L. (1991). Finite element analysis of nonlinear, coupled thermal-electric problems: The memory switch. J. Applied Physic 70,p1, 63–68.

    Article  Google Scholar 

  • Rosochowska, M., Balendra, R. and Chodnikiewicz, K. (2003). Measurements of thermal contact conductance. J. Materials Processing Technology 135,2–3, 204–210.

    Article  Google Scholar 

  • Singhal, V., Litke, P. J., Black, A. F. and Garimella, S. V. (2005). An experimentally validated thermo-mechanical model for the prediction of thermal contact conductance. Int. J. Heat and Mass Transfer 48,25–26, 5446–5459.

    Article  Google Scholar 

  • Volm, D., Walesch, R. and Bachmann, A. (2004). Simulation of the heat transfer mechanism in relays to improve contact reliability at freezing temperatures. Proc. 50th IEEE Holm Conf. Electrical Contacts and the 22nd Int. Conf. Electrical Contacts, 488–493.

  • Wünsche, S. (1996). Simulator coupling for electrothermal simulation of integrated circuits. Theminic’96, Int. Workshop on Thermal Investigations of IC’s and Microstructures Proc., 89–93.

  • Wünsche, S., Claub, C., Schwarz, P. and Winkler, F. (1997). Electro-thermal circuit simulation using simulator coupling. IEEE Trans. Very Large Scale Integration.

  • Zhang, J., Zavaliangos, A., Kraemer, M. and Groza, J. (2002). Finite element simulation of the temperature field in electric current aided sintering, in process modeling in powder metallurgy & particulate materials. Proc. 2002 Int. Conf. Process Modeling Powder Metallurgy & Particulate Materials, 208–215.

  • Zhang, X., Cong, P. Z. and Fujii, M. (2006). A study on thermal contact resistance at the interface of two solids. Int. J. Thermophysics 27,3, 880–895.

    Article  Google Scholar 

Download references

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to J. H. Lee.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Hwang, S.Y., Lee, J.H., Visuwanathan, K.K. et al. Experiments and thermal-electrical analysis of buss bar and relay assemblies in junction blocks. Int.J Automot. Technol. 14, 79–90 (2013). https://doi.org/10.1007/s12239-013-0010-6

Download citation

  • Received:

  • Revised:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s12239-013-0010-6

Key Words

Navigation