Abstract
The effects of Bi addition on the properties of Sn-3.0Ag-0.5Cu molten alloy on Cu substrates are discussed using wettability and interface microstructure analysis. The changes of the contact angles between Sn-3.0Ag-0.5Cu-xBi and Cu substrates with the spreading time are described by Dezellus model. It indicates that the spreading process is governed by the interfacial reaction during the dwelling time. The interface microstructure is observed to clarify the effects of reactions on the spreading behavior. It is found that Cu6Sn5 is formed adjacent to the solder and Cu3Sn appears over the substrate with Bi added at 613K, indicating that Bi exists between the intermetallics and the addition of Bi can hinder the diffusion of copper towards the interior of the solder. Therefore the existence of Bi decreases the agglomeration of Cu-Sn grains. The growth of intermetallics is thus limited and the shape of intermetallics transforms from scallop to zigzag consequently. However, the segregation phenomenon appears when the additive amount of Bi is more than 5.5mass %, which could lead to the occurrence of fracture and degrade the performance of Sn-3.0Ag-0.5Cu-xBi alloy. The results of the present study provide basic physical and chemical data for the application of lead-free solder in the future microgravity space environment.
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References
Li, Y., Moon, K., Wong, C.P.: Electronics without lead. Science 308(5727), 1419–1420 (2005)
Katsuaki, S.: Advances in lead-free electronics soldering. Curr. Opin. Solid State Mater. Sci. 5(1), 55–64 (2001)
Drápala, J., Kubíček, P., Kostiuková, G.: Study of interaction between copper and melt of lead-free solders. Metalurgija 52(4), 509–511 (2013)
Lai, H.L., Dai, J.G.: Lead-free Sn-Ag and Sn-Ag-Bi solder powders prepared by mechanical alloying. J. Electron. Mater 32(4), 215–220 (2003)
Suzuki, S., Kraatz, K.H., Frohberg, G.: Diffusion experiments in liquid Sn-Bi and Al-Ni systems with a stable density layering using the FOTON shear cell under 1g conditions. Microgravity Sci. Technol. 16(1), 120–126 (2005)
Sebo, P., Svec, P., Janickovic, D.: The influence of silver content on structure and properties of Sn-Bi-Ag solder and Cu/solder/Cu joints. Mater. Sci. Eng. A 571, 184–192 (2013)
Shnawah, D.F., Said, S.B.M., Sabri, M.F.M.: High-reliability low-Ag-content Sn-Ag-Cu solder joints for electronics applications. J. Electron. Mater. 41(9), 2631–2658 (2012)
Anderson, I.E.: Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications. J. Mater. Sci. Mater. Electron. 18(1), 55–76 (2007)
El-Daly, A.A., El-Taher, A.M., Gouda, S.: Development of new multicomponent Sn-Ag-Cu-Bi lead-free solders for low-cost commercial electronic assembly. J. Alloys Compd. 627, 268–275 (2015)
Mattila, T.T., Hokka, J., Paulasto-Kröckel, M.: The reliability of microalloyed Sn-Ag-Cu solder interconnections under cyclic thermal and mechanical shock loading. J. Electron. Mater. 43(11), 4090–4102 (2014)
Sun, L., Zhang, L.: Properties and microstructures of Sn-Ag-Cu-X lead-free solder joints in electronic packaging. Adv. Mater. Sci. Eng 2015, 1–16 (2015)
Vianco, P.T., Rejent, J.A.: Properties of ternary Sn-Ag-Bi solder alloys: Part I-Thermal properties and microstructural analysis. J. Electron. Mater. 28(10), 1127–1137 (1999)
An, C.Y., Toledo, R.C., Boschetti, C., Ribeiro, M.F., Bandeira, I.N.: Solidification of lead tin and lead telluride eutectic alloys in microgravity. Microgravity Sci. Technol. 25(5), 267–273 (2014)
Yin, L., Murray, B., Singler, T.: Dissolutive wetting in the Bi-Sn system. Acta Mater. 54(13), 3561–3574 (2006)
Dou, L., Yuan, Z.F., Fan, J.F.: Measurement and calculation of surface tension of molten Sn-Bi alloy. J. Colloid Interface Sci. 297(1), 261–265 (2005)
Zang, L.K., Yuan, Z.F., Xu, H.Y.: Wetting process and interfacial characteristics of Sn-3.1Ag-0.5Cu on different substrates at temperatures ranging from 503K to 673K. Appl. Surf. Sci. 257(11), 4877–4879 (2011)
Yuan, Z.F., Mukai, K.: Effect of boron on the surface tension of molten silicon and its temperature coefficient. J. Colloid Interface Sci. 270(1), 140–145 (2004)
Xu, B.S., Yuan, Z.F., Wu, Y.: Simulation analysis on surface morphology and hysteresis characteristics of molten Sn-3.0Ag-0.5Cu sitting on the inclined Ni substrate. Colloids Surf. A 441(1), 217–225 (2014)
Joanny, J.F., De Gennes, P.G.: A model for contact angle hysteresis. J. Chem. Phys 81(1), 552–562 (1984)
Iliev, S.D.: Static drops on an inclined plane: equilibrium modeling and numerical analysis. J. Colloid Interface Sci. 194(2), 287–300 (1997)
Moser, Z., Gasior, W., Pstrus, J., Debski, A.: Wettability studies of Pb-free soldering materials. Int. J. Theor. Phys. 29(6), 1974–1986 (2008)
Dezellus, O., Hodaj, F., Eustathopoulos, N.: Chemical reaction-limited spreading: the triple line velocity versus contact angle relation. Acta Mater. 50(19), 4741–4753 (2002)
Sharps, P.R., Tomsia, A.P., Pask, J.A.: Wetting and spreading in the Cu-Ag system. Acta Mater. 29 (5), 855–865 (1981)
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This work is supported by the Strategic Priority Research Program of the Chinese Academy of Sciences: SJ10–Recoverable Scientific Experiment Satellite (Grant No. XDA04020411, XDA04020202–11).
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Xu, B., Chen, J., Yuan, Z. et al. Spreading Dynamics and Interfacial Characteristics of Sn-3.0Ag-0.5Cu-xBi Melting on Cu Substrates. Microgravity Sci. Technol. 28, 115–122 (2016). https://doi.org/10.1007/s12217-015-9484-3
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DOI: https://doi.org/10.1007/s12217-015-9484-3