Abstract
The dependence of the solidification temperature on the concentration x of impurity atoms, M, of Sn-M x alloys after cooling from the melt was measured separately for M = Co, Ni, Ag, and Cu. For a comparison, similar measurements were performed on SAC305-Ni x alloys. Large variations in undercooling were observed. It was found that the Ag atoms dissolved in the Sn-Ag melt significantly lowered undercooling, although the presence of Ag3Sn intermetallic compounds did not. While Cu6Sn5 intermetallic compounds in Sn-Cu melts did not significantly lower undercooling, the undercooling of a Sn-Cu melt in contact with a Cu interface was significantly reduced. The addition of Ni to Pb-free solder SAC305 caused a factor of two reduction in the undercooling, similar to that observed after the addition of Ni to high-purity Sn.
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Acknowledgements
Larry Lehman is gratefully acknowledged for a review of this manuscript. This work is partially supported by U.S. Department of Defense, SERDP program. Part of this work was carried out at the Analytical and Diagnostics Laboratory (ADL) at Binghamton University.
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Parks, G., Faucett, A., Fox, C. et al. The Nucleation of Sn in Undercooled Melts: The Effect of Metal Impurities. JOM 66, 2311–2319 (2014). https://doi.org/10.1007/s11837-014-1161-2
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DOI: https://doi.org/10.1007/s11837-014-1161-2