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Numerical Studies of Infiltration Dynamics of Liquid–Copper and Silicon/Solid–Carbon System

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Abstract

Mathematical modeling of infiltration dynamics of liquid Cu-Si alloy into porous carbon is presented. Two-dimensional infiltration equations are developed using the Washburn equation in the limit of both interface and diffusion control, for situations where the capillary radius decreases either linear or parabolic, and the contact angles are assumed to exponentially decrease with time during infiltration. One major manufacturing process for the Cu-Si/C composites is liquid melt infiltration. This article focuses on nonequilibrium wetting effects and offers a fundamental approach to these complex kinetic phenomena.

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Acknowledgements

K. Iqbal is grateful to the China Scholarship Council (CSC) for funding Ph.D. scholarships.

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Authors and Affiliations

  1. State Key Laboratory of Structural Analyses for Industrial Equipment, School of Aeronautics and Astronautics, Dalian University of Technology, Dalian, 116024, China

    K. Iqbal & J. J. Sha

  2. State Key Laboratory of Structural Analyses for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, 116024, China

    Zhen-Kun Lei

  3. Department of Physics, Air University, Islamabad, Pakistan

    A. Maqsood

  4. School of Chemical and Materials Engineering, National University of Sciences and Technology, Islamabad, Pakistan

    M. Mujahid

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  1. K. Iqbal
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  2. J. J. Sha
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  3. Zhen-Kun Lei
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  4. A. Maqsood
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  5. M. Mujahid
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Correspondence to K. Iqbal.

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Iqbal, K., Sha, J.J., Lei, ZK. et al. Numerical Studies of Infiltration Dynamics of Liquid–Copper and Silicon/Solid–Carbon System. JOM 66, 953–959 (2014). https://doi.org/10.1007/s11837-014-0951-x

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  • DOI: https://doi.org/10.1007/s11837-014-0951-x

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