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Topics in Lead-Free Solders: Interfacial and Sn Whisker Growth

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References

  1. Industry Council for Electronic Equipment Recycling, London, http://www.icer.org.uk. Accessed 10 January 2012.

  2. Management Methods for Prevention and Control of Pollution from Production of Electronic and Information Products (English translation of draft comments for China RoHS, July 2003).

  3. Electronics Waste Recycling Act of 2003 (California S.B. 20/50), http://www.calrecycle.ca.gov/electronics/act2003/. Accessed 10 January 2012.

  4. Special Issue on Packaging and Soldering Technologies for Electronic Interconnects, JEM 29, 1111 (2000).

    Google Scholar 

  5. Lead-Free Solders section, JOM 53, 16 (2001).

  6. Special Issue on Lead-Free Solder Materials and Soldering Technologies, JEM 30, 1049 (2001).

    Google Scholar 

  7. Lead-Free Solders section, JOM 54, 25 (2002).

  8. Special Issue on Lead-Free Solders and Processing Issues in Microelectronic Packaging, JEM 31, 1129 (2002).

    Google Scholar 

  9. Lead-Free Solder section, JOM 55, 49 (2003).

  10. Special Issue on Lead-Free Solders and Processing Issues in Microelectronic Packaging, JEM 32, 1359 (2003).

    Google Scholar 

  11. Lead-Free Solder and Microelectronics section, JOM 56, 33 (2004).

  12. Special Issue on Lead-Free Solders and Processing Issues in Microelectronic Packaging, JEM 33, 1411 (2004).

    Google Scholar 

  13. Special Issue on Lead-Free Solder Implementation: Reliability, Alloy Development, New Technology, JEM 35, 2073 (2006).

  14. Special Issue on Pb-Free Electronic Solders: Alloy Design, Characterization, and Service Reliability, JEM 37, 1 (2008).

  15. Special Issue on Emerging Interconnect and Packaging Technologies, JEM 38, 209 (2009).

    Google Scholar 

  16. Special Issue on Pb-free Solders, JEM 38, 2427 (2009).

  17. Special Issue on Pb-Free Solders and Emerging Interconnect and Packaging Technologies, JEM 39, 2503 (2010).

    Google Scholar 

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  1. Power-one Renewable Energy, Inc., Phoenix, AZ, USA

    Srinivas Chada

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  1. Srinivas Chada
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Correspondence to Srinivas Chada.

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Chada, S. Topics in Lead-Free Solders: Interfacial and Sn Whisker Growth. JOM 64, 1174–1175 (2012). https://doi.org/10.1007/s11837-012-0443-9

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