April 2010, Volume 5, Issue 4, p 795,
Open Access This content is freely available online to anyone, anywhere at any time.
Date: 29 Jan 2010
Erratum to: Architectural Growth of Cu Nanoparticles Through Electrodeposition
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Erratum to: Nanoscale Res Lett (2009) 4:1481–1485 DOI 10.1007/s11671-009-9424-5
Unfortunately, the corresponding author name has been misspelled in the published version this paper.
Instead of Kaun-Jiuh Lin it should be Kuan-Jiuh Lin.
The online version of the original article can be found under doi:10.1007/s11671-009-9424-5.
- Erratum to: Architectural Growth of Cu Nanoparticles Through Electrodeposition
- Open Access
- Available under Open Access This content is freely available online to anyone, anywhere at any time.
Nanoscale Research Letters
Volume 5, Issue 4 , p 795
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- 1. Department of Chemistry, Center of Nanoscience and Nanotechnology, National Chung-Hsing University, 250, Kuo Kuang Rd., Taichung, 402, Taiwan, ROC
- 2. Experimental Facility Division, National Synchrotron Research Center, 101 Hsin-Ann Road, Hsinchu Science Park, Hsinchu, 30076, Taiwan, ROC