, Volume 5, Issue 4, p 795,
Open Access This content is freely available online to anyone, anywhere at any time.
Date: 29 Jan 2010

Erratum to: Architectural Growth of Cu Nanoparticles Through Electrodeposition

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Erratum to: Nanoscale Res Lett (2009) 4:1481–1485 DOI 10.1007/s11671-009-9424-5

Unfortunately, the corresponding author name has been misspelled in the published version this paper.

Instead of Kaun-Jiuh Lin it should be Kuan-Jiuh Lin.

The online version of the original article can be found under doi:10.1007/s11671-009-9424-5.