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Failure Analysis: Why Mistakes Are Made and How to Avoid Making One

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References

  1. P. Jacobs “EOS (Electrical Overstress)—The Old, Unknown Phenomena?” Int. Symp. Test. Fail. Anal. (ISTFA), 2012, pp. 156-63

  2. M. Gores “Mis-Identified Failures in FETs,” Int. Symp. Test. Fail. Anal. (ISTFA), 2008, pp. 481-84

  3. R. King, C. Van Schaick, and J. Lusk “Electrical Overstress of Nonencapsulated Aluminum Bond Wires,” Int. Reliab. Phys. Symp. (IRPS), 1989, pp. 141-51

  4. A. Munukutla, R. Rahn, and J. Lewis “Damage-Induced Field Failures of Electrical Contacts,” Int. Symp. Test. Fail. Anal. (ISTFA), 2009, pp. 347-51

Selected References

  • M. Horev Root Cause Analysis in Process-Based Industries, Trafford Publishing, 2008

  • C. Kepner, B. Tregoe, The Rational Manager: A Systematic Approach to Problem Solving and Decision-Making (McGraw-Hill Book Company, New York, 1965)

    Google Scholar 

  • R. Latino and K. Latino Root Cause Analysis: Improving Performance for Bottom Line Results, CRC Press, 1999

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Authors and Affiliations

  1. Accelerated Analysis, Half Moon Bay, CA, USA

    David Burgess

Authors
  1. David Burgess
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Correspondence to David Burgess.

Additional information

Editor’s Note: This article, originally published in Electronic Device Failure Analysis, serves as a great example of failure analysis lessons and practices that are applicable to a broader segment of industry beyond microelectronics. I encourage readers to review this article and consider them in the context of your failure analysis practice, regardless of industry.

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Burgess, D. Failure Analysis: Why Mistakes Are Made and How to Avoid Making One. J Fail. Anal. and Preven. 14, 697–701 (2014). https://doi.org/10.1007/s11668-014-9891-6

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  • DOI: https://doi.org/10.1007/s11668-014-9891-6

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