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Hygro-thermo-mechanical Behavior of Adhesive-Based Flexible Chip-on-Flex Packaging

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Abstract

Although adhesive-based chip-on-flex (COF) packaging technologies have many advantageous features, such as flexibility and compatibility with standard semiconductor and microelectronics packaging processes, the low hygro-thermal resistance leads to reliability concerns. Thus, finite element (FE) modeling and experimental testing have been used to investigate the effects of temperature and humidity conditions on the hygro-thermo-mechanical behavior of a thin flexible anisotropic conductive adhesive (ACA)-based COF packaging technology. The investigation starts from process modeling of the thermo-mechanical behavior of the technology during the ACA bonding process. The validity of the process modeling is demonstrated by temperature and warpage experiments. Furthermore, three-dimensional (3-D) transient moisture diffusion FE analysis through a thermal–moisture analogy based on the “wetness” technique is performed to evaluate the moisture distribution, in which the moisture properties of the polyimide (PI) substrate are obtained through a moisture absorption experiment. Then, the effect of the moisture properties of the ACA adhesive and PI substrate on the moisture diffusion behavior is examined. Finally, following process modeling, 3-D hygro-thermo-mechanical FE analysis under a constant temperature and humidity condition is undertaken to assess the influence of hygro-thermal aging and stress relaxation of the ACA adhesive on the long-term contact performance of the interconnects.

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Acknowledgements

The work is partially supported by the Ministry of Science and Technology, Taiwan, ROC, under Grants MOST 103-2221-E-035-024-MY3 and NSC 101-2221-E-007-009-MY3.

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Authors and Affiliations

  1. Department of Aerospace and Systems Engineering, Feng Chia University, Taichung, Taiwan

    Hsien-Chie Cheng

  2. Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan

    Ho-Hsiang Huang & Wen-Hwa Chen

  3. Electronics and Optoelectronics Research Laboratories, ITRI, Hsinchu, Taiwan

    Su-Tsai Lu

Authors
  1. Hsien-Chie Cheng
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  2. Ho-Hsiang Huang
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  3. Wen-Hwa Chen
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  4. Su-Tsai Lu
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Correspondence to Hsien-Chie Cheng or Wen-Hwa Chen.

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Cheng, HC., Huang, HH., Chen, WH. et al. Hygro-thermo-mechanical Behavior of Adhesive-Based Flexible Chip-on-Flex Packaging. J. Electron. Mater. 44, 1220–1237 (2015). https://doi.org/10.1007/s11664-015-3627-6

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  • DOI: https://doi.org/10.1007/s11664-015-3627-6

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