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Effect of Cr Addition on Wetting Behavior Between Cu and High-Temperature Zn-25Sn-0.15Al-0.1Ga-xCr Pb-Free Solder

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Abstract

In this study the effect of Cr content (0.02 wt.% to 0.2 wt.%) on the wetting interaction between high-temperature Zn-25Sn-0.15Al-0.1Ga-xCr Pb-free solders and Cu has been investigated using the wetting balance method. Differential scanning calorimetry (DSC) investigation showed that Cr addition reduces the liquidus temperature slightly while raising the solidus temperature. Flux-assisted wetting experiments were carried out at an immersion rate of 15 mm/s at 435°C. The results show that the shortest wetting time of around 0.7 s was achieved when 0.1 wt.% Cr was added, but the wetting force tends to decrease with the Cr content. Cr addition enhances the formation of interfacial Cu5Zn8 intermetallic compound (IMC) during air cooling, but the opposite effect was observed for water cooling. The results suggest that Cr addition depresses the formation of the Cu5Zn8 layer in liquid/solid reaction, but enhances the formation of the Cu5Zn8 layer in solid/solid reaction.

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Acknowledgements

Financial support of the present study from the National Science Council of the Republic of China under NSC101-2221-E-006-117-MY3 is gratefully acknowledged.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, National Cheng Kung University, Tainan, 70101, Taiwan, ROC

    Chin-Wei Liu & Kwang-Lung Lin

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  1. Chin-Wei Liu
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  2. Kwang-Lung Lin
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Correspondence to Kwang-Lung Lin.

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Liu, CW., Lin, KL. Effect of Cr Addition on Wetting Behavior Between Cu and High-Temperature Zn-25Sn-0.15Al-0.1Ga-xCr Pb-Free Solder. J. Electron. Mater. 43, 4502–4509 (2014). https://doi.org/10.1007/s11664-014-3449-y

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  • DOI: https://doi.org/10.1007/s11664-014-3449-y

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