Abstract
Solder durability models frequently focus on the applied strain range; however, the rate of applied loading, or strain rate, is also important. In this study, an approach to incorporate strain rate dependency into durability estimation for solder interconnects is examined. Failure data were collected for SAC105 solder ball grid arrays assembled with SAC305 solder that were subjected to displacement-controlled torsion loads. Strain-rate-dependent (Johnson–Cook model) and strain-rate-independent elastic–plastic properties were used to model the solders in finite-element simulation. Test data were then used to extract damage model constants for the reduced-Ag SAC solder. A generalized Coffin–Manson damage model was used to estimate the durability. The mechanical fatigue durability curve for reduced-silver SAC solder was generated and compared with durability curves for SAC305 and Sn-Pb from the literature.
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References
S. Ganesan and M.G. Pecht, Lead-Free Electronics. Wiley-IEEE, Hoboken, 2006.
H. Kim, M. Zhang, C.M. Kumar, D. Suh, P. Liu, D. Kim, M. Xie, and Z. Wang, Electron Comp. Technol. Conf. 57, 962 (2007).
R. Dudek, W. Faust, S. Wiese, M. Rollig, and B. Michel, Electron. Packag. Technol. Conf. 9, 14 (2007).
D.Y.R. Chong, K. Ng, J.Y.N. Tan, P.T.H. Low, J.H.L. Pang, F.X. Che, B.S. Xiong, and L.H. Xu, Drop impact reliability testing for lead-free and leaded soldered IC packages. Electron. Comp. Technol. Conf. 55, 622 (2005).
W.H. Zhu, L. Xu, J.H.L. Pang, X.R. Zhang, E. Poh, Y.F. Sun, A.Y.S. Sun, C.K. Wang, and H.B. Tan, Electron. Comp. Technol. Conf. 58, 1667 (2008).
W. Liu, P. Bachorik, and N.C. Lee, Electron. Comp. Technol. Conf. 58, 452 (2008).
E.H. Wong, S.K.W. Seah, C.S. Selvanayagam, R. Rajoo, W.D. van Driel, J.F.J.M. Caers, X.J. Zhao, N. Owens, M. Leoni, L.C. Tan, Y.-S. Lai, and C.L. Yeh, J. Electron. Mater. 38, 884 (2009).
C.J. Zhan, C.C. Chuang, T.C. Chang, L.C. Shen, International Microsystems Packaging Assembly and Circuits Technology Conference, pp 66–70, 2007.
F. Song, S.W.R. Lee, K. Newman, H. Reynolds, S. Clark, and B. Sykes, Electron. Packag. Technol. Conf. 9, 463 (2007).
D. Suh, D.W. Kim, P. Liu, H. Kim, J.A. Weninger, C.M. Kumar, A. Prasad, B.W. Grimsley, and H.B. Tejada, Mater. Sci. Eng. 460–461, 595 (2007).
M. Reid, J. Punch, M. Collins, and C. Ryan, Conference on Soldering and Surface Mount Technology, pp. 3–8, 2008.
Y. Liu, F.J.H.G. Kessels, W.D. van Driel, J.A.S. van Driel, F.L. Sun, and G.Q. Zhang, Microelectron. Reliab. 49, 1299 (2009).
G. Khatibi, W. Wroczewski, B. Weiss, and H. Ipser, Microelectron. Reliab. 49, 1283 (2009).
M. Osterman, A. Dasgupta, and B. Han, Electron. Comp. Technol. Conf. 56, 7 (2006).
J.C. Suhling, H.S. Gale, R.W. Johnson, M.N. Islam, T. Shete, P. Lall, M.J. Bozack, J.L. Evans, P. Seto, T. Gupta, and J.R. Thompson, The Ninth Intersociety Conference on Thermal and Thermo-mechanical Phenomena in Electronic Systems 2, 350 (2004).
X. Fan, G. Raiser, and V.S. Vasudevan, Electron. Comp. Technol. Conf. 55, 901 (2005).
Z.W. Zhong, Microelectron. Int. 21, 25 (2004).
Guidelines for accelerated reliability testing of surface mount solder attachments. IPC-SM-785 Association Connecting Electronics Industries, 1992.
A. Zubelewicz, R. Tokarz, R. Kuracina, and J. McGinniss, Adv. Electron. Packag., ASME 10, 1167 (1995).
W.C.M. Filho, M. Brizoux, H. Fremont, Y. Danto, Seventh International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, pp. 1–6 (Dresden, Germany, 2006).
J.H.L. Pang, K.H. Ang, X.Q. Shi, and Z.P. Wang, IEEE Trans. Adv. Packag. 24, 507 (2001).
V. Srinivas, M. Al-Bassyiouni, M. Osterman, M. Pecht, International Mechanical Engineering Congress & Exposition, ASME (Anaheim, CA, 2009).
V. Srinivas, M. Osterman, R. Farell, M. Pecht, APEX EXPO, IPC (Las Vegas, 2010).
H. Qi, Q. Zhang, E.C. Tinsley, M. Osterman, and M. Pecht, IEEE Trans. Compon. Packag. Technol. 31, 309 (2008).
J. Gu, D. Barker, and M. Pecht, Microelectron. Reliab. 47, 1849 (2007).
Guidelines for performance test methods and qualification requirements for surface mount solder attachments, IPC-9701, 2002.
M. Yunus, A. Primavera, K. Srihari, J.M. Pitarresi, 26th IEEE/CPMT International Symposium on Electronics Manufacturing Technology, 43, 207, 2000.
C. Ryan, J. Punch, and B. Rodgers, 13th International Conference Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, pp. 436–440, 2005.
S. Yee and H. Ladhar, Circ. World 25, 25 (1999).
W.C.M. Filho, M. Brizoux, H. Fremont, and Y. Danto, 18th European Symposium on Reliability of Electron Devices Failure Physics and Analysis in Microelectronics Reliability 47, 1663 (2007).
P.A. Engel and Y. Ling, ASME J. Electron. Packag. 115, 22 (1993).
P.A. Engel, Structural Analysis Printed Circuit Board Systems (New York: Springer, 1993).
P.A. Engel and T.M. Miller, IEEE Trans. Compon. Hybrids Manuf. Technol. 16, 577 (1993).
S.S. Shetty, (MS Thesis, Department of Mechanical Engineering, University of Maryland, 1999).
L. Xu, K.E. Tan, and J.H.L. Pang, Electron. Syst.-Integr. Technol. Conf. 1, 845 (2008).
F. Qin, T. An, and N. Chen, J. Appl. Mech. 77, 110081 (2010).
V. Srinivas, M. Al-Bassyiouni, M. Osterman, and M. Pecht, International Mechanical Engineering Congress & Exposition, ASME (Anaheim, CA, 2009).
J.M. Kim, S.W. Woo, Y.S. Chang, Y.J. Kim, J.B. Choi, and K.Y. Ji, Thin Solid Films, International Conference on Microelectronics and Plasma Technology 517, 4255 (2009).
X. Fan, M. Pei, and P.K. Bhatti, Proceedings of the Electronic Components and Technology Conference, 2006.
A.R. Syed, Proceedings 54th Electronic Components and Technology Conference (Las Vegas, 2004).
R. Darveaux, Proceedings of the TMS Annual Meeting, pp. 213–218 (Orlando, FL, 1997).
F.X. Che and J.H.L. Pang, Proceedings of 6th IEEE Electronics Packaging Technology Conference (Singapore, 2004).
Y. Zhou, (Ph.D. Dissertation, University of Maryland, 2009).
S. Wiese and S. Rzepka, Microelectron. Reliab. 44, 1893 (2004).
F.X. Che, W.H. Zhu, E.S.W. Poh, X.W. Zhang, and X.R. Zhang, J. Alloy. Compd. 507, 215 (2010).
G.R. Johnson and W.H. Cook, Proceedings of the Seventh International Symposium on Ballistics, pp. 541–547 (Hague, The Netherlands, 1983).
X. Niu, G. Yuan, Z. Li, and X. Shu, Int. J. Mod. Phys. B 22, 1117 (2008).
W.W. Lee, L.T. Nguyen, and G.S. Selvaduray, Microelectron. Reliab. 40, 231 (2000).
S.S. Manson and G.R. Halford, Fatigue and Durability of Structural Materials (Materials Park, OH: ASM International, 2006), p. 49.
Y. Kariya, T. Hosoi, S. Terashima, M. Tanaka, and M. Otsuka, J. Electron. Mater. 33, 321 (2004).
Y. Zhou, M. Al-Bassyiouni, and A. Dasgupta, J. Electron. Packag. 131, 011016-1 (2009).
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Srinivas, V., Menon, S., Osterman, M. et al. Modeling the Rate-Dependent Durability of Reduced-Ag SAC Interconnects for Area Array Packages Under Torsion Loads. J. Electron. Mater. 42, 2606–2614 (2013). https://doi.org/10.1007/s11664-013-2575-2
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DOI: https://doi.org/10.1007/s11664-013-2575-2