Skip to main content
SpringerLink
Log in

Effects on Undercooling and Interfacial Reactions with Cu Substrates of Adding Bi and In to Sn-3Ag Solder

  • Published:
Journal of Electronic Materials Aims and scope Submit manuscript

Abstract

This study investigated the effects of adding Bi and In to Sn-3Ag Pb-free solder on undercooling, interfacial reactions with Cu substrates, and the growth kinetics of intermetallic compounds (IMCs). The amount of Sn dominates the undercooling, regardless of the amount or species of further additives. The interfacial IMC that formed in Sn-Ag-Bi-In and Sn-In-Bi solders is Cu6Sn5, while that in Sn-Ag-In solders is Cu6(Sn,In)5, since Bi enhances the solubility of In in Sn matrices. The activation energy for the growth of IMCs in Sn-Ag-Bi-In is nearly double that in Sn-Ag-In solders, because Bi in the solder promotes Cu dissolution. The bright particles that form inside the Sn-Ag-In bulk solders are the ζ-phase.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. P.G. Kim and K.N. Tu, Mater. Chem. Phys. 53, 165 (1998).

    Article  CAS  Google Scholar 

  2. A. Sharif and Y.C. Chan, J. Alloys Compd. 390, 67 (2005).

    Article  CAS  Google Scholar 

  3. T.H. Chuang, K.W. Huang, and W.H. Lin, J. Electron. Mater. 33, 374 (2004).

    Article  CAS  ADS  Google Scholar 

  4. M.L. Huang and L. Wang, Metall. Mater. Trans. A 36A, 1439 (2005).

    Article  CAS  Google Scholar 

  5. M.S. Yeh, Metall. Mater. Trans. A 34A, 361 (2003).

    Article  CAS  Google Scholar 

  6. M. He and V.L. Acoff, J. Electron. Mater. 37, 288 (2008).

    Article  CAS  ADS  Google Scholar 

  7. Y. Kariya and M. Otsuka, J. Electron. Mater. 27, 1229 (1998).

    Article  CAS  ADS  Google Scholar 

  8. P.T. Vianco and J.A. Rejent, J. Electron. Mater. 28, 1138 (1999).

    Article  CAS  ADS  Google Scholar 

  9. P.T. Vianco and J.A. Rejent, J. Electron. Mater. 28, 1127 (1999).

    Article  CAS  ADS  Google Scholar 

  10. C.W. Hwang, J.G. Lee, K. Suganuma, and H. Mori, J. Electron. Mater. 32, 52 (2003).

    Article  CAS  ADS  Google Scholar 

  11. S.W. Shin and J. Yu, J. Electron. Mater. 34, 188 (2005).

    Article  CAS  ADS  Google Scholar 

  12. M. Kamal, E.S. Gouda, and L.K. Marei, Cryst. Res. Technol. 44, 1308 (2009).

    Article  CAS  Google Scholar 

  13. K.S. Kim, T. Imanishi, K. Suganuma, M. Ueshima, and R. Kato, Microelectron. Reliab. 47, 1113 (2007).

    Article  CAS  Google Scholar 

  14. R.K. Shiue, L.W. Tsay, C.L. Lin, and J.L. Ou, J. Mater. Sci. 38, 1269 (2003).

    Article  CAS  Google Scholar 

  15. A.T. Wu, M.H. Chen, and C.H. Huang, J. Alloys Compd. 476, 436 (2009).

    Article  CAS  Google Scholar 

  16. A.T. Wu, M.H. Chen, and C.N. Siao, J. Electron. Mater. 38, 252 (2008).

    Article  ADS  Google Scholar 

  17. K.-W. Moon, W.J. Boettinger, U.R. Kattner, F.S. Biancaniello, and C.A. Handwerker, J. Electron. Mater. 29, 1122 (2000).

    Article  CAS  ADS  Google Scholar 

  18. S.K. Kang, M.G. Cho, P. Lauro, and D.Y. Shih, Proceedings of the 57th ECTC (2007), p. 1597.

  19. V.T. Witusiewicz, U. Hecht, B. BÖttger, and S. Rex, J. Alloys Compd. 428, 115 (2007).

    Article  CAS  Google Scholar 

  20. I. Ohnuma, Y. Cui, X.J. Liu, Y. Inohana, S. Ishihara, H. Ohtani, R. Kainuma, and K. Ishida, J. Electron. Mater. 29, 1113 (2000).

    Article  CAS  ADS  Google Scholar 

  21. S.W. Chen, C.H. Wang, S.K. Lin, and C.N. Chiu, J. Mater. Sci. Mater. Electron. 18, 19 (2006).

    Article  Google Scholar 

  22. X.J. Liu, Y. Inohana, Y. Takaku, I. Ohnuma, R. Kainuma, K. Ishida, Z. Moser, W. Gasior, and J. Pstrus, J. Electron. Mater. 31, 1139 (2002).

    Article  CAS  ADS  Google Scholar 

  23. T.M. Korhonen and J.K. Kivilahti, J. Electron. Mater. 27, 149 (1998).

    Article  CAS  ADS  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Institute of Materials Science and Engineering, National Central University, Jhongli City, 320, Taiwan

    Yu-Yan Chiang

  2. Department of Chemical and Materials Engineering, National Central University, Jhongli City, 320, Taiwan

    Robbin Cheng & Albert T. Wu

Authors
  1. Yu-Yan Chiang
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Robbin Cheng
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Albert T. Wu
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Albert T. Wu.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Chiang, YY., Cheng, R. & Wu, A.T. Effects on Undercooling and Interfacial Reactions with Cu Substrates of Adding Bi and In to Sn-3Ag Solder. J. Electron. Mater. 39, 2397–2402 (2010). https://doi.org/10.1007/s11664-010-1347-5

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11664-010-1347-5

Keywords

Search

Navigation