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Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy

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The tin-based alloy Sn-1.5Ag-0.7Cu-9.5In (composition in wt.%) is a potential candidate for lead-free soldering at temperatures close to 200°C due to the significant amount of indium. Samples of Sn-1.5Ag-0.7Cu-9.5In were prepared by controlled melting of the pure elements, followed by quenching to room temperature. The samples were analyzed by scanning electron microscopy/energy-dispersive x-ray spectroscopy (SEM/EDS) and electron backscatter diffraction. The solidified melt consisted of four different phases. Solidification behavior was monitored by heat-flux differential scanning calorimetry (DSC). The phase equilibrium has been further investigated by thermodynamic calculations. The observed phase compositions as well as DSC signals are reasonably explained using the calculation of phase diagrams (CALPHAD) approach.

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Acknowledgements

The authors are grateful to Dr. Aleš Kroupa from the Institute of Physics of Materials, Czech Academy of Sciences Brno for his assistance with the EDX measurements. One of the authors (M.P.) would like to thank Dr. Ruth Knibbe from the Division of Fuel Cells and Solid State Chemistry, Risø National Laboratory (Roskilde, Denmark) for her careful proof-reading of the text. Project support through Grants VEGA 1/3032/06, VEGA 1/3191/06, MSM0021622410, and COST MP0602/08 is also fully acknowledged.

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Correspondence to Marián Palcut.

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Sopoušek, J., Palcut, M., Hodúlová, E. et al. Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy. J. Electron. Mater. 39, 312–317 (2010). https://doi.org/10.1007/s11664-009-1070-2

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  • DOI: https://doi.org/10.1007/s11664-009-1070-2

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