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Impact Behavior of Thermomechanically Fatigued Sn-Based Solder Joints

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Abstract

Impact behavior of Sn-3 wt.%Ag-0.5 wt.%Cu (SAC 305) solder joints subjected to thermomechanical fatigue in different temperature regimes was investigated. This study was aimed at understanding the roles of distributed cracks that develop near the solder/substrate interface region during early stages of thermal excursions. Two specimen geometries were employed to evaluate mode I and mode II types of fracture under impact in solder joints several hundred microns thick. The peak stress that could be withstood in mode I fracture under impact decreased with increasing number of thermomechanical fatigue cycles, while mode II fracture was insensitive to the same. No observable influence on the impact strength due to the temperature regimes was noted. However, the fracture surfaces of specimens subjected to thermal excursions at the lower-temperature regime were predominantly along the Cu6Sn5/solder interface, while specimens subjected to the higher-temperature regime predominantly fractured along the Sn-Sn grain boundaries. These observations are consistent with the findings of prior studies dealing with damage accumulation in the early stages of thermal excursions in these temperature regimes.

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Acknowledgements

The authors wish to thank Nippon Steel Corporation for the financial support facilitating Mr. Kobayashi’s stay at Michigan State University and the project. They also thank Drs. D. Liu and G. Li of the Mechanical Engineering Department at Michigan State University for the use of the impact facility and helpful discussions.

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Authors and Affiliations

  1. Michigan State University, East Lansing, MI, 48824, USA

    Takayuki Kobayashi, Andre Lee & K. N. Subramanian

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  1. Takayuki Kobayashi
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  2. Andre Lee
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  3. K. N. Subramanian
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Correspondence to Andre Lee.

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Kobayashi, T., Lee, A. & Subramanian, K.N. Impact Behavior of Thermomechanically Fatigued Sn-Based Solder Joints. J. Electron. Mater. 38, 2659–2667 (2009). https://doi.org/10.1007/s11664-009-0890-4

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  • DOI: https://doi.org/10.1007/s11664-009-0890-4

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