Abstract
The compatibility between Ag fillers and Sn-Pb plating at elevated temperature was examined by mechanical test, electrical test, and microstructure observation. The degradation at 150°C is caused by the preferential diffusion of Sn from the plating layer into Ag in the conductive adhesive. By this diffusion, Ag-Sn intermetallic compounds formed in the Ag fillers adjacent to the plating layer, and many large Kirkendall voids are formed in the Sn-Pb plating layer. Furthermore, an interfacial debonding occurred between the conductive adhesive, and the Sn-Pb plating layer is also observed near the free surface after heat exposure.
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Yamashita, M., Suganuma, K. Degradation mechanism of ag-epoxy conductive adhesive/Sn-Pb plating interface by heat exposure. J. Electron. Mater. 31, 551–556 (2002). https://doi.org/10.1007/s11664-002-0124-5
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DOI: https://doi.org/10.1007/s11664-002-0124-5