Abstract
Samples of graphene composites with matrix of copper were prepared by electrochemical codeposition from CuSO4 solution with graphene oxide suspension. The thermal conductivity of the composite samples with different thickness and that of electrodeposited copper was determined by the three-omega method. Copper-graphene composite films with thickness greater than 200 μm showed an improvement in thermal conductivity over that of electrolytic copper from 380 W/m.K to 460 W/m.K at 300 K (27 °C). The thermal conductivity of copper-graphene films decreased from 510 W/m.K at 250 K (–23 °C) to 440 W/m.K at 350 K (77 °C). Effective medium approximation (EMA) was used to model the thermal conductivity of the composite samples and determine the interfacial thermal conductance between copper and graphene. The values of interface thermal conductance greater than 1.2 GW/m2.K obtained from the acoustic and the diffuse mismatch models and from the EMA modeling of the experimental results indicate that the interface thermal resistance is not a limiting factor to improve the thermal conductivity of the copper-graphene composites.
Similar content being viewed by others
References
E.M. Garmire and M.T. Tavis: IEEE J. Quant. Electron., 1984, vol. QE-20, pp. 1277–80.
J. Piprek, J.K. White, and A.J. Spring Thorpe: IEEE J. Quant. Electron., 2002, vol. 38, pp. 1253–59.
V.O. Turin: Electron. Lett., 2004, vol. 40, pp. 81–83.
G.A. Slack: J. Appl. Phys., 1964, vol. 35, pp. 3460–66.
G.A. Slack: Phys. Rev., 1962, vol. 127, pp. 694–701.
P. Kim, L. Shi, A. Majumdar, and P.L. McEuen: Phys. Rev. Lett., 2001, vol. 87, pp. 215502-1–4.
A.A. Balandin, S. Ghosh, W. Bao, I. Calizo, D. Teweidebrhan, F. Miao, and C.N. Lau: Nano Lett., 2008, vol. 92, pp. 151911-1–3.
A.A. Balandin, S. Ghosh, W. Bao, I. Calizo, D. Teweldebrhan, F. Miao, and C.N. Lau: Nano Lett., 2008, vol. 8, pp. 902–07.
J.H. Seol, I. Jo, A.L. Moore, L. Lindsay, Z.H. Aitken, M.T. Pettes, X. Li, Z. Yao, R. Huang, D. Broido, N. Mingo, R.S. Ruoff, and L. Shi: Science, 2010, vol. 328, pp. 213–16.
R. Prasher: Proc. IEEE, 2006, vol. 94, pp. 1571–87.
A.N. Sruti and K. Jagannadham: J. Elect. Mater., 2010, vol. 39, pp. 1268–76.
K. Jaganandham: J. Elect. Mater., 2011, vol. 40, pp. 25–34.
K. Jagannadham: J. Electrochem. Soc., in press.
S. Stankovich, D.A. Dikin, R.D. Piner, K.M. Kohlhaas, A. Kleinhammes, Y. Jia, Y. Wu, S.T. Nguyen, and R.S. Ruoff: Carbon, 2007, vol. 45, pp. 1558–65.
J. Kim, L.J. Cote, F. Kim, W. Yuan, K.R. Shull, and J. Huang: J. Amer. Chem. Soc., 2010, vol. 132, pp. 8180–86.
E.E. Underwood: Applications of Quantitative Metallography, Mechanical Testing, Metals Handbook, 8th ed., vol. 8, ASM, Materials Park, OH, 1973, p. 37.
D.G. Cahill: Rev. Sci. Instrum., 1990, vol. 61, pp. 802–08.
J.H. Kim, A. Feldman, and D. Novotny: J. Appl. Phys., 1999, vol. 86, pp. 3959–63.
Y.S. Touloukian and E.H. Buyco: Thermophysical Properties of Matter, The TPRC Data Series, Specific Heat of Metallic Elements and Alloys, vol. 4, and Specific Heat of Nonmetallic Solids, vol. 5, IFI/Plenum, New York, NY, 1970.
J. Yang: in Thermal Conductivity: Theory, Properties, and Applications, T.M. Tritt, ed., Kluwer Academic/Plenum Press, New York, NY, 2004, p. 1.
S. Ghosh, D.L. Nika, E.P. Pokatilov, and A.A. Balandin: New J. Phys., 2009, vol. 11, pp. 095012-1–19.
S. Ghosh, I. Calizo, D. Teweldebrhan, E.P. Pokatilov, D.L. Nika, A.A. Balandin, W. Bao, F. Miao, and C.N. Lau: Appl. Phys. Lett., 2008, vol. 92, pp. 151911-1–3.
D.L. Nika, E.P. Pokatilov, A.S. Askerov, and A.A. Balandin: Phys. Rev. B, 2009, vol. 79, pp. 155413-1–12.
D.L. Nika, S. Ghosh, E.P. Pokatilov, and A.A. Balandin: Appl. Phys. Lett., 2009, vol. 94, pp. 203103-1–3.
Z. Ghuo, D. Zhang, and X.G. Gong: Appl. Phys. Lett., 2009, vol. 95, pp. 163103-1–3.
P.G. Klemens: Int. J. Thermophysics, 2001, vol. 22, pp. 265–75.
P.G. Klemens and D.F. Pedraza: Carbon, 1994, vol. 32, pp. 735–41.
A. Majumdar and P. Reddy: Appl. Phys. Lett., 2004, vol. 84, pp. 4768–71.
D.L. Martin: Phys. Rev. B, 1973, vol. 8, pp. 5357–60.
A.C. Anderson and R.E. Peterson: Phys. Lett., 1972, vol. 38A, pp. 519–20.
R. Viana, H. Godfrin, E. Lerner, and R. Rapp: Phys. Rev. B, 1994, vol. 50, pp. 4875–77.
R.S. Deacon, K.C. Chuang, R.J. Nicholas, K.S. Novoselov, and A.K. Gein: Phys. Rev. B, 2007, vol. 76, pp. 08140 6-1–4.
E.T. Swartz and R.O. Pohl: Rev. Mod. Phys., 1989, vol. 33, pp. 605–68.
A. Minnich and G. Chen: Appl. Phys. Lett., 2007, vol. 91, pp. 073105-1–3.
B.C. Gundrum, D.G. Cahill, and R.S. Averback: Phys. Rev. B, 2005, vol. 72, pp. 245426-1–5.
A.J. Schmidt, K.C. Collins, A.J. Minnich, and G. Chen: J. Appl. Phys., 2010, vol. 107, pp. 104907-1–5.
A.J. Schmidt, K.C. Collins, A.J. Minnich, and G. Chen: Rev. Sci. Instrum., 2008, vol. 79, pp. 114902-1–9.
J.C. Duda, J.L. Smoyer, P.M. Norris, and P.E. Hopkins: Appl. Phys. Lett., 2009, vol. 95, pp. 031912-1–3.
Acknowledgment
This research is supported by National Science Foundation Grant CMMI #1049751.
Author information
Authors and Affiliations
Corresponding author
Additional information
Manuscript submitted August 14, 2011.
Rights and permissions
About this article
Cite this article
Jagannadham, K. Thermal Conductivity of Copper-Graphene Composite Films Synthesized by Electrochemical Deposition with Exfoliated Graphene Platelets. Metall Mater Trans B 43, 316–324 (2012). https://doi.org/10.1007/s11663-011-9597-z
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11663-011-9597-z