Metallurgical and Materials Transactions A

, Volume 44, Issue 7, pp 2914–2916

Effect of Temperature on the Die Shear Strength of a Au-Sn SLID Bond

Authors

    • SINTEF ICT Instrumentation
    • Institute for Micro and Nanosystems TechnologyVestfold University College
  • Ole Martin Løvvik
    • SINTEF Materials and Chemistry
    • Department of PhysicsUniversity of Oslo
  • Knut Aasmundtveit
    • Institute for Micro and Nanosystems TechnologyVestfold University College
  • Andreas Larsson
    • SINTEF ICT Instrumentation
Communication

DOI: 10.1007/s11661-013-1725-8

Cite this article as:
Tollefsen, T.A., Løvvik, O.M., Aasmundtveit, K. et al. Metall and Mat Trans A (2013) 44: 2914. doi:10.1007/s11661-013-1725-8

Abstract

The effect of temperature on the die shear strength of a optimized Au-Sn solid–liquid interdiffusion SLID bond, a reliable high temperature die attach and interconnect technology, was investigated. The shear strength was greatly reduced with temperature from 140 MPa at room temperature to 20 MPa at 573 K (300 °C). This reduction was unexpected since the melting point of a Au-Sn SLID bond is 795 K (522 °C). Fractographic studies revealed a change in fracture mode with increasing temperatures. This work emphasizes the importance of performing bond strength quantification at the intended application temperature.

Copyright information

© The Minerals, Metals & Materials Society and ASM International 2013