, Volume 44, Issue 7, pp 2914-2916
Date: 17 Apr 2013

Effect of Temperature on the Die Shear Strength of a Au-Sn SLID Bond

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Abstract

The effect of temperature on the die shear strength of a optimized Au-Sn solid–liquid interdiffusion SLID bond, a reliable high temperature die attach and interconnect technology, was investigated. The shear strength was greatly reduced with temperature from 140 MPa at room temperature to 20 MPa at 573 K (300 °C). This reduction was unexpected since the melting point of a Au-Sn SLID bond is 795 K (522 °C). Fractographic studies revealed a change in fracture mode with increasing temperatures. This work emphasizes the importance of performing bond strength quantification at the intended application temperature.

Manuscript submitted January 15, 2013.