Abstract
A novel micromechanical device was developed to convert the compressive force applied by a nanoindenter into pure tensile loading at the sample stages inside a scanning electron microscope or a transmission electron microscope, in order to mechanically deform a one-dimensional nanostructure, such as a nanotube or a nanowire. Force vs. displacement curves for samples with Young’s modulus above a threshold value can be obtained independently from readings of a quantitative high resolution nanoindenter with considerable accuracy, using a simple conversion relationship. However, in-depth finite element analysis revealed the existence of limitations for the device when testing samples with relatively low Young’s modulus, where forces applied on samples derived from nanoindenter readings using a predetermined force conversion factor will no longer be accurate. In this paper, we will demonstrate a multi-step method which can alleviate this problem and make the device capable of testing a wide range of samples with considerable accuracy.
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Abbreviations
- MEMS:
-
Micro-electro-mechanical systems
- FEA:
-
Finite element analysis
- SEM:
-
Scanning electron microscope
- TEM:
-
Transmission electron microscope
- AFM:
-
Atomic force microscope
- 1-D:
-
One-dimensional
- SOI:
-
Silicon on insulator
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Acknowledgments
This work was supported by National Science foundation grant NSF ECCS 0702766 and by Air Force Research laboratory grant AFRL FA8650-07-2-5061. The authors gratefully acknowledge Brian Peters (MTS Nano Instruments, Oak Ridge, TN), Ryan Stromberg and Richard Nay (Hysitron Inc., Minneapolis, MN) for the help they provided with device testing. The authors would also like to thank Dr. J. E. Akin and Xiaoge Gan (Rice University, Houston, TX), Dr. A. Minor (Lawrence Berkeley Lab, Berkeley, CA), Dr. R. Ballarini (University of Minnesota, Minneapolis, MN) for useful discussions.
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Lu, Y., Ganesan, Y. & Lou, J. A Multi-step Method for In Situ Mechanical Characterization of 1-D Nanostructures Using a Novel Micromechanical Device. Exp Mech 50, 47–54 (2010). https://doi.org/10.1007/s11340-009-9222-0
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DOI: https://doi.org/10.1007/s11340-009-9222-0