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Growth of CuPd nanoalloys encapsulated in carbon-shell

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Abstract

Preparation of nanostructured copper-palladium (CuPd) alloys is getting more attention because specific catalytic properties can be tuned by controlling their composition, size, and shape. Thus, a better understanding especially in the formation mechanism of the CuPd nanoalloys is of great importance in designing the catalysts. Growth of CuPd nanoalloys encapsulated in carbon-shell (CuPd@C) was, therefore, studied by in situ synchrotron small-angle X-ray scattering during temperature-programed carbonization (TPC) of the Cu2+- and Pd2+-β-cyclodextrin complexes. A rapid reduction of Cu2+ and Pd2+ with nucleation is found at the temperatures of <423 K, followed by coalescence at 453–573 K. The well-dispersed CuPd nanoalloys having the sizes of 7.6–7.9 nm in diameter are encapsulated in carbon-shell of 1.4–1.8 nm in thickness. The refined extended X-ray absorption fine structure spectra indicate that the bond distances of the first-shell Cu–Pd are 2.61–2.64 Å with the coordination numbers of 5.1–5.6. A homogeneous CuPd alloy at the Cu/Pd atomic ratio of 1 is observed. Note that at the high Cu/Pd ratio, Cu is enriched on the CuPd nanoalloy surfaces, attributable to the relatively low surface free energy of Cu.

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Acknowledgments

The financial supports of the Taiwan National Science Council, Bureau of Energy, and the National Synchrotron Radiation Research Center are gratefully acknowledged.

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Authors and Affiliations

  1. Department of Environmental Engineering, National Cheng Kung University, Tainan, 70101, Taiwan

    H. Y. Kang & H. P. Wang

  2. Sustainable Environmental Research Center, National Cheng Kung University, Tainan, 70101, Taiwan

    H. P. Wang

  3. Center for Micro/Nano Science and Technology, National Cheng Kung University, Tainan, 70101, Taiwan

    H. P. Wang

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  1. H. Y. Kang
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  2. H. P. Wang
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Correspondence to H. P. Wang.

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Kang, H.Y., Wang, H.P. Growth of CuPd nanoalloys encapsulated in carbon-shell. J Nanopart Res 15, 1672 (2013). https://doi.org/10.1007/s11051-013-1672-8

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  • DOI: https://doi.org/10.1007/s11051-013-1672-8

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