Research Paper

Journal of Nanoparticle Research

, Volume 11, Issue 8, pp 2043-2047

Uncapped silver nanoparticles synthesized by DC arc thermal plasma technique for conductor paste formulation

  • Manish ShindeAffiliated withCentre for Materials for Electronics Technology (C-MET)
  • , Amol PawarAffiliated withCentre for Materials for Electronics Technology (C-MET)
  • , Soumen KarmakarAffiliated withDepartment of Physics, Pune University
  • , Tanay SethAffiliated withCentre for Materials for Electronics Technology (C-MET)
  • , Varsha RautAffiliated withCentre for Materials for Electronics Technology (C-MET)
  • , Sunit RaneAffiliated withCentre for Materials for Electronics Technology (C-MET)
  • , Sudha BhoraskarAffiliated withDepartment of Physics, Pune University
  • , Dinesh AmalnerkarAffiliated withCentre for Materials for Electronics Technology (C-MET) Email author 

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Abstract

Uncapped silver nanoparticles were synthesized by DC arc thermal plasma technique. The synthesized nanoparticles were structurally cubic and showed wide particle size variation (between 20–150 nm). Thick film paste formulated from such uncapped silver nanoparticles was screen-printed on alumina substrates and the resultant ‘green’ films were fired at different firing temperatures. The films fired at 600 °C revealed better microstructure properties and also yielded the lowest value of sheet resistance in comparison to those corresponding to conventional peak firing temperature of 850 °C. Our findings directly support the role of silver nanoparticles in substantially depressing the operative peak firing temperature involved in traditional conductor thick films technology.

Keywords

Silver Nanoparticles Plasma synthesis TEM Conductivity SEM Thermal plasma reactor Thin film