Journal of Nanoparticle Research

, 11:2043

Uncapped silver nanoparticles synthesized by DC arc thermal plasma technique for conductor paste formulation

Authors

  • Manish Shinde
    • Centre for Materials for Electronics Technology (C-MET)
  • Amol Pawar
    • Centre for Materials for Electronics Technology (C-MET)
  • Soumen Karmakar
    • Department of PhysicsPune University
  • Tanay Seth
    • Centre for Materials for Electronics Technology (C-MET)
  • Varsha Raut
    • Centre for Materials for Electronics Technology (C-MET)
  • Sunit Rane
    • Centre for Materials for Electronics Technology (C-MET)
  • Sudha Bhoraskar
    • Department of PhysicsPune University
    • Centre for Materials for Electronics Technology (C-MET)
Research Paper

DOI: 10.1007/s11051-008-9569-7

Cite this article as:
Shinde, M., Pawar, A., Karmakar, S. et al. J Nanopart Res (2009) 11: 2043. doi:10.1007/s11051-008-9569-7

Abstract

Uncapped silver nanoparticles were synthesized by DC arc thermal plasma technique. The synthesized nanoparticles were structurally cubic and showed wide particle size variation (between 20–150 nm). Thick film paste formulated from such uncapped silver nanoparticles was screen-printed on alumina substrates and the resultant ‘green’ films were fired at different firing temperatures. The films fired at 600 °C revealed better microstructure properties and also yielded the lowest value of sheet resistance in comparison to those corresponding to conventional peak firing temperature of 850 °C. Our findings directly support the role of silver nanoparticles in substantially depressing the operative peak firing temperature involved in traditional conductor thick films technology.

Keywords

Silver Nanoparticles Plasma synthesis TEM Conductivity SEM Thermal plasma reactor Thin film

Copyright information

© Springer Science+Business Media B.V. 2008