Journal of Materials Science: Materials in Medicine

, Volume 22, Issue 6, pp 1555–1567

Fabrication of nano-structured electrospun collagen scaffold intended for nerve tissue engineering


  • A. Timnak
    • Faculty of Biomedical EngineeringAmirkabir University of Technology
  • F. Yousefi Gharebaghi
    • Faculty of Biomedical EngineeringAmirkabir University of Technology
  • R. Pajoum Shariati
    • Faculty of Chemical EngineeringAmirkabir University of Technology
  • S. H. Bahrami
    • Faculty of Textile EngineeringAmirkabir University of Technology
  • S. Javadian
    • Department of BiochemistryPasteur Institute of Iran
  • Sh. Hojjati Emami
    • Faculty of Biomedical EngineeringAmirkabir University of Technology
    • National Cell Bank of IranPasteur Institute of Iran

DOI: 10.1007/s10856-011-4316-5

Cite this article as:
Timnak, A., Yousefi Gharebaghi, F., Pajoum Shariati, R. et al. J Mater Sci: Mater Med (2011) 22: 1555. doi:10.1007/s10856-011-4316-5


Nerve tissue engineering is one of the most promising methods in nerve tissue regeneration. The development of blended collagen and glycosaminoglycan scaffolds can potentially be used in many soft tissue engineering applications. In this study an attempt was made to develop two types of random and aligned electrospun, nanofibrous scaffold using collagen and a common type of glycosaminoglycan. Ion chromatography test, MTT and attachment assays were conducted respectively to trace the release of glycosaminoglycan, and to investigate the biocompatibility of the scaffold. Cell cultural tests showed that the scaffold acted as a positive factor to support connective tissue cell outgrowth. The positive effect of fiber orientation on cell outgrowth organization was traced through SEM images. Porosity percentage calculation and tensile strength measurement of the webs specified analogous properties to the native neural matrix tissue. These results suggested that nanostructured porous collagen-glycosaminoglycan scaffold is a potential cell carrier in nerve tissue engineering.

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© Springer Science+Business Media, LLC 2011