Abstract
Multi-walled carbon nanotube (MWCNT)-reinforced solderable isotropic polymer nanocomposites (SIPNs) containing low-melting-point alloys (LMPAs) were developed to enhance the interconnection properties of solderable isotropic polymer composites (SIPCs). In this study, the reliability properties of MWCNT-reinforced SIPN assemblies with different MWCNT concentrations were investigated through thermal shock (−55–125 °C, 1000 cycles) and high-temperature and high-humidity (85 °C, 85 %RH, 1000 h) tests. In addition, the interfacial microstructure and fracture mode of the MWCNT-reinforced SIPN joint were investigated. All the MWCNT-reinforced SIPN assemblies, with different MWCNT concentrations, showed stable electrical reliability during reliability tests owing to the formation of a metallurgical interconnection between the corresponding metallization layers by molten LMPA fillers. The mechanical reliability properties of all the MWCNT-reinforced SIPN assemblies degraded owing to excessive intermetallic compound (IMC) layer growth. However, the mechanical reliability properties of MWCNT-reinforced SIPNs with a low MWCNT concentration (<1 wt%) were superior to those of the SIPNs without MWCNTs owing to the initial high bonding strength of the former due to the reinforcing effect of MWCNTs.
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Acknowledgments
This research was supported by Basic Science Research Program through the National Research Foundation of Korea (NRF) funded by the Ministry of Science, ICT and future Planning (2014007164) and the Human Resources Program in Energy Technology of the Korea Institute of Energy Technology Evaluation and Planning (KETEP) granted financial resource from the Ministry of Trade, Industry & Energy, Republic of Korea (No. 20134030200350).
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Yim, BS., Kim, JM. Effect of multi-walled carbon nanotube (MWCNT) concentration on thermomechanical reliability of MWCNT-reinforced solderable isotropic polymer nanocomposites. J Mater Sci: Mater Electron 27, 9159–9171 (2016). https://doi.org/10.1007/s10854-016-4952-0
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DOI: https://doi.org/10.1007/s10854-016-4952-0