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Spherical and flake-like BN filled epoxy composites: morphological effect on the thermal conductivity, thermo-mechanical and dielectric properties

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Abstract

Epoxy composites, with boron nitride spheres (s-BN) and flakes (f-BN) as fillers were prepared. The effect of filler morphology, content, and crystallization of BN particles on the thermal conductivity, thermo-mechanical and dielectric properties of the composites were investigated. At the same loading level, s-BN with smaller size and larger surface area led to much more significant increase in the glass transition temperature (T g ), reduction in the coefficient of thermal expansion and lower storage modulus (E′), while much higher thermal conductivities were observed in epoxy composites containing f-BN, owing to the larger aspect ratio and better crystallization. In addition, the introduction of BN fillers only did slightly increase on the dielectric constant and dielectric loss of the epoxy resin. We believe, the BN enhanced epoxy composites, with significantly improved thermal conductivity and thermo-mechanical properties, yet maintaining low dielectric constant and dielectric loss at the same time, have great application potential in the microelectronic insulation industry.

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Acknowledgments

This work was financially supported by the National Basic Research Program of China (973 Program) (2015CB057206), National Natural Science Foundation of China (21101165), Guangdong Innovative Research Team Program (Nos. 2011D052 and KYPT20121228160843692), Shenzhen Electronic Packaging Materials Engineering Laboratory (2012-372), Shenzhen Basic Research Plan (JC201005270372A and GJHS20120702091802836).

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Authors and Affiliations

  1. Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen, 518055, Guangdong, China

    Liang Huang, Pengli Zhu, Gang Li, Fengrui Zhou, Daoqiang Lu & Rong Sun

  2. Shenzhen College of Advanced Technology, University of Chinese Academy of Sciences, Shenzhen, 518055, Guangdong, China

    Liang Huang

  3. School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA, USA

    Chingping Wong

  4. Department of Electronic Engineering, The Chinese University of Hong Kong, Hong Kong, China

    Chingping Wong

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  1. Liang Huang
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  2. Pengli Zhu
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  3. Gang Li
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Correspondence to Pengli Zhu.

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Huang, L., Zhu, P., Li, G. et al. Spherical and flake-like BN filled epoxy composites: morphological effect on the thermal conductivity, thermo-mechanical and dielectric properties. J Mater Sci: Mater Electron 26, 3564–3572 (2015). https://doi.org/10.1007/s10854-015-2870-1

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  • DOI: https://doi.org/10.1007/s10854-015-2870-1

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