Journal of Materials Science: Materials in Electronics

, Volume 21, Issue 11, pp 1202–1206

Interdiffusion studies in bulk Au–Ti system


DOI: 10.1007/s10854-009-0047-5

Cite this article as:
Kumar, A.K. & Paul, A. J Mater Sci: Mater Electron (2010) 21: 1202. doi:10.1007/s10854-009-0047-5


The performance of the contacts, where Au/Ti layers are used in the metallization scheme, largely depends on the product phases grown by interdiffusion at the interface. It is found that four intermetallic compounds grow with narrow homogeneity range and wavy interfaces in the interdiffusion zone. The presence of wavy interfaces is the indication of high anisotropy in diffusion of the product phases. This also reflects in the deviation of parabolic growth from the average. Further, we have determined the relevant diffusion parameters, such as interdiffusion coefficient in the penetrated region of the end members and integrated diffusion coefficients of the intermetallic compounds.

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© Springer Science+Business Media, LLC 2009

Authors and Affiliations

  1. 1.Department of Materials Engineering and Centre for Electronics Design and TechnologyIndian Institute of ScienceBangaloreIndia