Abstract
Interfacial reactions between Sn–57Bi–1Ag and electroless Ni-P/immersion Au were investigated following isothermal aging at 85 and 130 °C. A long-term aging study confirmed two intermetallics at the solder/substrate interface. With scanning electron microscopy and energy-dispersive X-ray spectroscopy (EDX) analysis, the metastable NiSn4 phase was detected coexisting with the stable Ni3Sn4 phase. The average thicknesses of both intermetallic compounds (IMCs) were graphically plotted versus the square root of aging time. The EDX showed that Ni3Sn4 nucleated first. However, after nucleation, the IMC of the NiSn4 phase grew faster than the one of Ni3Sn4 between 85 and 130 °C. For both temperatures, the growth constants were calculated and the corresponding activation energies were approximated. A high volume of Kirkendall voids appeared along the Ni3Sn4/NiSn4 interface at 130 °C, resulting in dramatic shear strength decline.
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Chen SW, Wang CH, Lin SK, Chiu CN (2007) In: Subramanian K (ed) Lead-free electronic solders: a special issue of journal of materials science: materials in electronics, 1st edn. Springer, New York, p 19
Abtew M, Selvaduray G (2000) Mater Sci Eng 27(5/6):95
Kang SK, Sarkhel AK (1994) JEM 23(8):701
Suganuma K (2002) ESPEC Technol Rep 13:1
Hwang JS (2001) Environment-friendly electronics: lead-free technology. Electrochemical Publications, Isle of Man
Dong W, Shi Y, Zhidong Xia, Lei Y, Guo F (2008) J Electron Mater 37(7):982
Vianco PT (1999) Soldering handbook, 3rd edn. American Welding Society, Miami
Shangguan D (2005) Lead-free solder interconnect reliability. ASM International, Materials Park
Frear DR (2007) In: Subramanian K (ed) Lead-free electronic solders: a special issue of journal of materials science: materials in electronics, 1st edn. Springer, New York, p 319
Vianco PT, Kilgo AC, Grant R (1995) J Electron Mater 24(10):1493
Liu Z, Shang P, Pang X, Shang J (2008) In: IEEE ICEPT-HDP
Kang T, Xiub Y, Liu C, Hui L, Wang J, Tonga W (2011) J Alloy Compd 509(5):1785
Chen C, Ho CE, Lin AH, Luo GL, Kao CR (2000) J Electron Mater 29(10):1200
Yoon J, Lee C, Jung S (2002) Mater Trans 43(8):1821
Young B, Duh J (2001) J Electron Mater 30(7):878
Wang J, Liu HS, Liu LB, Jin ZP (2006) J Electron Mater 35(10):1842
Haimovich J (1989) Weld J 68(3):102
Chen C, Chen S (2003) J Mater Res 18(6):1293
Boettinger WJ, Vaudin MD, Williams ME, Bendersky LA, Wagner WR (2003) J Electron Mater 32(6):511
Chuang HY, Chen WM, Shih WL, Lai YS, Kao CR (2011) In: Electronic Components and Technology Conference, p 1723
Glazer J (1994) J Electron Mater 23(8):693
Kattner UR, Boettinger WJ (1994) J Electron Mater 23(7):603
Wang C, Kuo C, Chen H, Chen S (2011) Intermetallics 19(1):75
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Fuchs, C., Schreck, T. & Kaloudis, M. Interfacial reactions between Sn–57Bi–1Ag solder and electroless Ni-P/immersion Au under solid-state aging. J Mater Sci 47, 4036–4041 (2012). https://doi.org/10.1007/s10853-012-6257-x
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DOI: https://doi.org/10.1007/s10853-012-6257-x