Abstract
Scanning and transmission electron microscopy were used to study the interface composition and morphology of copper wire-bonds heat-treated at 175 °C for 2, 24, 96, and 200 h in argon. Detailed morphological and compositional characterization of the Al–Cu heat-treated interfaces was conducted on site-specific specimens prepared by focused ion beam milling. Discontinuous intermetallic grains with varying size and morphology were found to grow in regions where they originally nucleated during the bonding process. The main intermetallic phase was Al2Cu, which was found to grow via solid-state diffusion. In specimens heat-treated for 96 and 200 h, the Al4Cu9 phase was also detected. Void formation at the Al–Cu bonds heat-treated up to 200 h was not found to be a source of bond failure.
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References
Harman G (1997) Wire bonding in microelectronics materials, processes, reliability and yield. McGraw-Hill, New York
Drozdov M, Gur G, Atzmon Z, Kaplan WD (2008) J Mater Sci. doi:https://doi.org/10.1007/s10853-008-2954-x
Brydson R, Bruley J, Mullejans H, Scheu C, Ruhle M (1995) Ultramicroscopy 59(1–4):81. doi:https://doi.org/10.1016/0304-3991(95)00020-2
Sadan H, Kaplan WD (2006) J Mater Sci 41(16):5099. doi:https://doi.org/10.1007/s10853-006-0437-5
Toyozawa K, Fujita K, Minamide S, Maeda T (1990) IEEE Trans Compon Hybr Manuf Technol 13(4):667. doi:https://doi.org/10.1109/33.62577
Singh I Sr, On JY, Levine L Sr (2005) Proc Electron Compon Technol 55(1):843
Tan CW, Daud AR (2002) J Mater Sci Mater Electron 13(5):309. doi:https://doi.org/10.1023/A:1015580227090
Murali S, Srikanth N, Vath CJ (2003) Mater Charact 50(1):39. doi:https://doi.org/10.1016/S1044-5803(03)00102-5
Wulff FW, Breach CD, Saraswati SD, Dittmer KJ (2004) Proceedings of electronics packaging technology confernce, Singapore, 8–10 December, p 348
Onuki J, Koizumi M, Araki I (1987) IEEE Trans Compon Hybr Manuf Technol 10(4):550. doi:https://doi.org/10.1109/TCHMT.1987.1134799
Ratchev P, Stoukatch S, Swinnen B (2006) Microelectron Reliab 46(8):1315. doi:https://doi.org/10.1016/j.microrel.2005.11.002
Kim H-J, Lee JY, Paik K-W et al (2003) IEEE Trans Compon Packag Tech 26(2):367. doi:https://doi.org/10.1109/TCAPT.2003.815121
Murali S, Srikanth N, Wong YM, Vath CJ (2007) J Mater Sci 42(2):615. doi:https://doi.org/10.1007/s10853-006-1148-7
Karpel A, Gur G, Atzmon Z, Kaplan WD (2007) J Mater Sci 42(7):2334. doi:https://doi.org/10.1007/s10853-007-1592-z
Karpel A, Gur G, Atzmon Z, Kaplan WD (2007) J Mater Sci 42(7):2347. doi:https://doi.org/10.1007/s10853-007-1593-y
Murali S, Srikanth N, Vath CJ (2006) J Electron Packag 128(3):192. doi:https://doi.org/10.1115/1.2229214
Thangadurai P, Lumelsky Y, Silverstein MS, Kaplan WD (2008) Mater Charact. doi:https://doi.org/10.1016/j.matchar.2008.02.007
Murray JL (1985) Int Met Rev 30(5):211
Hill A, Wallach ER (1989) Acta Metall 37(9):2425. doi:https://doi.org/10.1016/0001-6160(89)90040-0
Takahashi Y, Inoue K, Nishiguchi K (1993) Acta Metall Mater 41(11):3077. doi:https://doi.org/10.1016/0956-7151(93)90036-R
Hamm RA, Vandenberg JM (1984) J Appl Phys 56(2):293. doi:https://doi.org/10.1063/1.333960
Acknowledgements
The authors wish to thank A. Berner, Y. Kauffmann, and I. Popov for fruitful discussions. This research was partially supported by the Russell Berrie Nanotechnology Institute at the Technion.
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Drozdov, M., Gur, G., Atzmon, Z. et al. Detailed investigation of ultrasonic Al–Cu wire-bonds: II. Microstructural evolution during annealing. J Mater Sci 43, 6038–6048 (2008). https://doi.org/10.1007/s10853-008-2955-9
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DOI: https://doi.org/10.1007/s10853-008-2955-9