Abstract
Selective etching of CoFeNiCu/Cu multilayers was investigated with different solutions: HNO3/alcohol, FeCl3/HCl, K2Cr2O7/H2SO4 and dilutions of FeCl3/HCl, K2Cr2O7/H2SO4. Polarization curves on a rotating disk electrode were used to assess the corrosion potential and current density of Cu, and Co-rich alloys. Preferential etching of the Co-rich alloy was attributed to either a less positive corrosion potential or a higher corrosion current density compared to the Cu layer. A dilution of the aqueous K2Cr2O7/H2SO4 solution was considered most promising for submicron structure development.
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Chou S.Y., Krauss P.R., and Renstrom P.J.(1996). Science 272: 85
Chou S.Y., Krauss P.R., and Renstrom P.J.(1996), Journal of Vacuum Science and Technology B 14: 4129
Sotomayor Torres C.M., Zankovych S., Seekamp J., Kam A.P., Clavijo Cedeno C., Hoffmann T., Ahopelto J., Reuther F., Pfeiffer K., Bleidiessel G., Gruetzner G., Maximov M.V., and Heidari B.(2003). Materials Science and Engineering, C: Biomimetic and Supramolecular Systems C23: 23
Chou S.Y., Krauss P.R., and Renstrom P.J.(1995). Applied Physics Letters 67: 3114
Chou S.Y., Krauss P.R., Zhang W., Guo L., and Zhuang L. (1997). Journal of Vacuum Science and Technology B 15: 2897
Li M., Wang J., Zhuang L., and Chou S.Y.(2000). Applied Physics Letters 76: 673
Wang J., Schablitsky S., Yu Z., W Wu, and Chou S.Y.(1999). Journal of Vacuum Science and Technology B 17: 2957
Baibich M.N., Broto J.M., Fert A., Nguyen F., Van Dau, F. Petroff, Eitenne P., Creuzet G., Friederich A., and Chazelas J. (1988). Physics Review Letters 61: 2472
Binasch G., Gruenberg P., Saurenbach F., and Zinn W.(1989). Physical Review B: Condense Matter and Materials Physics 39: 4828
Jimbo M., Kanda T., Goto S., Tsunashima S., and S.Uchiyama (1992). Journal of Applied Physics 31 part 2 : L1348
Alper M., Attenborough K., Hart R., Lane S.J., Lashmore D.S., Younes C., and Schwarzacher W.(1993). Applied Physics Letters 63: 2144
Ross C.A.(1994). Annual Review of Material Sciences 24:159
Bird K.D., and Schlesinger M.(1995). Journal of the Electrochemical Society 142: L65
Chassaing E., Nallet P., and Trichet M.F.(1996). Journal of the Electrochemical Society 143: L98
Leith S.D., and Schwartz D.T.(1999). Journal of Micromechanics and Microengineering 9: 97
Arai S., Hasegawa T., and Kaneko N.(2003). Journal of the Electrochemical Society 150: C798
Bonhote C., and Landolt D.(1997). Electrochimica Acta 42: 2407
Bradley P.E., and Landolt D.(1999). Electrochimica Acta 45: 1077
Che-Yih Lim, Huang Q., Xie X., Safir A., Harfenist S.A., Cohn R., and Podlaha E.J.(2004). Journal of Applied Electrochemistry 34: 857
Huang Q., Young D.P., Chan J.Y., Jiang J., and Podlaha E.J.(2002). Journal of the Electrochemical Society, 149: C349
Huang Q., Young D.P., and Podlaha E.J.(2003). Journal of Applied Physics 94: 1864
Huang Q., and Podlaha J. (2004). Journal of the Electrochemical Society 151 : C119
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Osaka T., Takai M., Sogawa Y., Momma T., Ohashi K., Saito M., Yamada K.(2004). Journal of the Electrochemical Society 146: 2092
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This work was supported by the National Science Foundation.
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Huang, Q., Podlaha, E. Selective etching of CoFeNiCu/Cu multilayers. J Appl Electrochem 35, 1127–1132 (2005). https://doi.org/10.1007/s10800-005-9008-8
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DOI: https://doi.org/10.1007/s10800-005-9008-8