Abstract
Three-point bending tests on nanocrystalline Cu or Cu/Ni-film/Cu-substrate samples were conducted in-situ with scanning electron microscopy (SEM) observations. The SEM in-situ observations show undulation deformation of the surface of thin film, as the thin film fractures easily at the concave–convex points of deformation and multi-cracks appear on the surface of the thin film in a periodic fashion. The critical wavelength of undulation is calculated based on experimental observations, which are comparable with the theoretical predictions. For the Cu/Ni multi-layered films/substrate structures, the micro-cracking pattern depends on the interfacial strength between the film and the substrate, rather than the interfacial strength between the layers of films.
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Wang, XS., Yan, CK., Li, Y. et al. SEM in-situ investigation on failure of nanometallic film/substrate structures under three-point bending loading. Int J Fract 151, 269–279 (2008). https://doi.org/10.1007/s10704-008-9257-8
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DOI: https://doi.org/10.1007/s10704-008-9257-8