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High-adhesive electroless copper plating on polyethylene surface modified with primer

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Abstract

In this work, the region-selective electroless copper plating on the surface of calcium carbonate (CaCO3)-filled polyehtylene (PE) (CFP) films have been established based on printing primer by screen printing in combination with electroless copper plating. Results showed only the printed areas formed amine groups on the surface of CFP sheets, which served as cores for adsorbing Pd2+ ions. Thus, the pattern on the screen was transferred to the surface of CFP sheets after electroless plating. When the plated time increased from 5 to 120 min, the thickness of plated coating was enhanced from 0.12 to 10 μm and the electrical resistivity was decreased from 12,544 to 0.4 Ω cm. The blown PE films mixed with foam powders and CaCO3 powders could form the coarse surface which can provide a large area for mechanical anchor between the primer and the plated coating, resulting in a better adhesion of the plated coating. In addition, the copper patterning possessed excellent selectivity, compactness, and flexibility. The EMI-SE of plated CFP films is above 30 dB.

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Acknowledgements

The authors would like to thank the financial supports from the General Project of Natural Science in Colleges and Universities in Anhui Province (grant no. KJ2015B1105905 and KJ2015B1105906) and the Opening Project of CAS Key Laboratory of Materials for Energy Conversion (grant no. KF2016001).

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Authors and Affiliations

  1. Department of Chemical and Materials Engineering, Hefei University, Hefei City, 230601, People’s Republic of China

    Junjun Huang, Fang Zhou, Yuan Yuan, Wei Chen & Min Gao

  2. Key Laboratory of Materials for Energy Conversion, Chinese Academy of Sciences, Hefei City, 230601, People’s Republic of China

    Junjun Huang

  3. Hefei Lucky and Technology Industry Co. Ltd, Hefei City, 230041, People’s Republic of China

    Junjun Huang & Hui Wang

  4. Guangxi Key Laboratory of Calcium Carbonate Resources Comprehensive Utilization, College of Materials and Environmental Engineering, Hezhou University, Hezhou City, 542899, People’s Republic of China

    Zhenming Chen

  5. Department of Materials Science and Engineering, Liaocheng University, Liaocheng, 252000, People’s Republic of China

    Yanhu Zhan

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  1. Junjun Huang
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  2. Zhenming Chen
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  3. Fang Zhou
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  4. Hui Wang
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  5. Yuan Yuan
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  6. Wei Chen
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  7. Min Gao
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  8. Yanhu Zhan
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Correspondence to Zhenming Chen.

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Highlights

• Region-selective electroless copper plating on the calcium carbonate-filled polyehtylene films can be achieved when the substrates were printed primer with a pattern.

• The print areas formed higher density of amine groups.

• The plated copper patterning possesses high adhesion.

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Huang, J., Chen, Z., Zhou, F. et al. High-adhesive electroless copper plating on polyethylene surface modified with primer. J Solid State Electrochem 21, 1559–1566 (2017). https://doi.org/10.1007/s10008-016-3503-1

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  • DOI: https://doi.org/10.1007/s10008-016-3503-1

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