Abstract
A MEMS based vacuum packaging method is developed for uncooled optically readable infrared focal plane array (OR-IRFPA). The vacuum packaging structure is made up of three layers: a glass visible window, a silicon spacer, and a silicon infrared window. The silicon spacer is bonded with the glass visible window to form two cavities: one cavity for getter and another one for OR-IRFPA. The isolation wall with micrometer scale pores is designed to ensure air’s free flow between two cavities and prevent getter powder from harming pixels of OR-IRFPA. The infrared window is used as cover board and selectively transmitting 8–14 μm infrared radiation. Infrared images of human body are gotten by using the vacuum packaged OR-IRFPA, which shows the vacuum packaging method is feasible and useful for OR-IRFPA.
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Acknowledgments
This work was partly supported by National Natural Science Foundation of China, Nos. 61172151 and 60876081, the National High Technology Research and Development Program of China (863 Program), No. 2009AA04Z317, and project of Science and Technology Commission of Shanghai Municipality, No. 14DZ1105102.
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Feng, F., Zhang, Y., Luo, F. et al. MEMS based vacuum packaging method of optically readable infrared focal plane array. Microsyst Technol 23, 1793–1798 (2017). https://doi.org/10.1007/s00542-016-3036-7
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DOI: https://doi.org/10.1007/s00542-016-3036-7