Skip to main content
Log in

Active gap reduction in comb drive of three axes capacitive micro accelerometer for enhancing sense capacitance and sensitivity

  • Technical Paper
  • Published:
Microsystem Technologies Aims and scope Submit manuscript

Abstract

The performance of micro-machined sensors is primarily determined via the sensitivity of sensing electrode to displacement. This paper presents the design, modelling, optimization and fabrication of an active gap reduction mechanism used on a conventional comb drive to enhance the capacitance in a three axes capacitive micro accelerometer. The design parameters of the active gap reduced comb drive (AGRCD) are optimized for best performance. The finite element analysis of the AGRCD is performed for design verification. The modeling and simulation results demonstrated a 534 % increase in sensitivity of the three axes capacitive micro accelerometer. The three axes capacitive micro accelerometer with AGRCD is fabricated using a commercially available standard metal-multi user MEMS processes.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11
Fig. 12
Fig. 13
Fig. 14
Fig. 15
Fig. 16
Fig. 17

Similar content being viewed by others

References

  • Ayazi F, Najafi K (2000) High aspect-ratio combined poly and single crystal silicon (HARPSS) MEMS technology. J Microelectromech Syst 9:288–294

    Article  Google Scholar 

  • Bazaz SA, Iqbal A, Khan MS (2013) Monolithic tri-axes nickel based accelerometer design verified through finite element analysis. Arab J Sci Eng 38:2103–2113

    Article  Google Scholar 

  • Bellot MM (2007) Microelectromechanical sytems (MEMS) safe and arm devices. Master thesis, Air Force Institute of Technology, USA

  • CoventorWare (2011) Description of CoventorWare, CoventorWare for MEMS CAD Design. http://www.coventor.com/coventorware.html

  • Cowen A, Dudley B, Hill E, Walters M, Wood R, Johnson S, Wynands H, Hardy B (2000) MetalMUMPs Design Handbook. Revision 2.0, MEMSCap Inc., USA. http://www.memscap.com/mumps/documents/MetalMUMPs.DR.2.0.pdf

  • Hirano T, Furuhata T, Gabriel KJ, Fujita H (1992) Design fabrication and operation of submicron gap comb-drive microactuators. J Microelectromech Syst 1:52–59

    Article  Google Scholar 

  • Iqbal A, Bazaz SA (2012) Behavioral modeling of monolithically integrated tri-axis capacitive accelerometer based on MetalMUMPs. Simul J Trans Soc Model Simul Int 88:565–579

    Article  Google Scholar 

  • Pottenger MD (2001) Design of micromachined inertial sensors. PhD Dissertation, University of California

  • Pourkamali S, Ayazi F (2003) SOI-based HF and VHF single crystal silicon resonators with sub-100 nanometer vertical capacitive gaps. In: Proceedings of solid-state sensor and actuator workshop, pp 837–840

  • Riaz K, Bazaz SA, Saleemb MM, Shakoor RI (2011) Design, damping estimation and experimental characterization of decoupled 3-DoF robust MEMS gyroscope. Sens Actuators A 172:523–532

    Article  Google Scholar 

  • Riaz K, Mian MU, Bazaz SA (2013) Fabrication imperfection analysis of robust decoupled 3-DoF non-resonant MEMS gyroscope. Int J Sci Eng Res 4:686–694

    Google Scholar 

  • Roylance LM, Angell JB (1979) Batch-fabricated silicon accelerometer. IEEE Trans Electr Devices 26:1911–1917

    Article  Google Scholar 

  • Seng AB, Dahari Z, Miskam MA, Sidek O (2009) Design and analysis of thermal microactuator. Eur J Sci Res 35:281–292

    Google Scholar 

  • Toda MR, Takeda N, Murakoshi T, Nakamura S, Esashi M (2002) Electrostatically levitated spherical 3-axis accelerometer. In: Proceedings of 15th IEEE international conference on micro electro mechanical systems (MEMS’02), pp 710–712

  • Tsai M-H, Sun C-M, Wang C, Lu J, Fang W (2008) A monolithic 3D fully-differential CMOS accelerometer. In: Proceedings of the 3rd IEEE international conference on nano/micro engineered and molecular systems, Sanya, China

  • Tsuchiya T, Funabashi H (2004) A z-axis differential capacitive SOI accelerometer with vertical comb electrodes. Sens Actuators A 116:378–383

    Article  Google Scholar 

Download references

Acknowledgments

This work was supported by the Higher Education Commission (HEC) of Pakistan [Grant No. 1012] and the National ICT Fund of Pakistan [Grant No. ICTRDF/TRED/2008/02].

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Abid Iqbal.

Additional information

K. Riaz and A. Iqbal participated equally in the paper.

Appendices

Appendix A

1.1 Electrothermal model

It has been found that heat lost through convection and radiation to the ambient can be neglected in comparison with heat dissipated through conduction. This is because the thermal conductivity of Nickel is much larger than ambient air. Therefore, the heat dissipated through convection and radiation to the ambient is neglected for the temperature distribution analysis. Since the length of each arm is much larger than its width and height, a two dimensional model is developed to simplify the analysis as shown in Fig. 18. Using Fig. 18, the steady state heat transfer equations is derived for the arm of the thermal actuator.

Fig. 18
figure 18

Single beam structure

According to the principle of heat transfer, heat conduction is given by:

$$ Q = - K_{p} A\frac{\partial T}{\partial x}, $$
(13)

where K p is the thermal conductivity of layer which is Nickel in case of MetalMUMPS, A is the conductive cross sectional area, T is the temperature and x is the length of the structure. If heat is transferred into the structure and then out of the structure, the heat conduction into the structure is given as:

$$ Q_{I} = - K_{p} whA\left( {\frac{\partial T}{\partial x}} \right)_{x} . $$
(14)

While the heat conduction out of the structure is given by:

$$ Q_{o} = - K_{p} whA\left( {\frac{\partial T}{\partial x}} \right)_{x + dx} , $$
(15)

where w is the width and h is the height of the thermal actuator. When voltage is applied between the two terminals of this thermal actuator, current is passed through the entire system and travels from one anchor to the other. This results in the joule heat given as:

$$ Q_{J} = - J^{2} \rho whdx, $$
(16)
$$ \rho = \rho 0[1 + \zeta (T - T0)], $$
(17)
$$ J = \frac{V}{\rho L}, $$
(18)

where J is the current density, ρ is the resistivity of the structure, ρ 0 is the resistivity of the beam at temperature T 0, T 0 is the substrate temperature, ζ is the temperature coefficient of resistance, V is the voltage across the arm and L is the length of the arm.

According to the first law of thermodynamics (conservation of energy), resistive heating is equal to the heat conduction out of the element (Seng et al. 2009), this yield:

$$ Q_{I} + \, Q_{J} = \, Q_{0} . $$
(19)

Substituting Eqs. 14, 15 and 16 in Eq. 19, taking the limit as dx → 0, produces the following second order differential equation given by Eq. 20:

$$ K_{p} wh\left( {\frac{{\partial^{2} T}}{{\partial x^{2} }}} \right) + J^{2} \rho wh = 0. $$
(20)

Since the micro actuator has the same conductive cross sectional area, Eq. 20 is reduced to:

$$ \left( {\frac{{\partial^{2} T}}{{\partial x^{2} }}} \right) = - \frac{{J^{2} \rho }}{{K_{p} }}. $$
(21)

The boundary conditions assumed are that the anchor pads have the same temperature as the substrate, T 0, that is:

$$ T\left( 0 \right) = T\left( L \right) = Ts. $$
(22)

Solving Eqs. 21 and 22 gives the temperature distribution along the arm as:

$$ T\left( x \right) = \frac{{V^{2} }}{{2L^{2} \rho K_{p} }}\left( {Lx - x^{2} } \right) + T_{s} . $$
(23)

From Eq. 23, it is clear that the temperature is parabolic and symmetric about the centre point of the length with a maximum temperature, Tm, at x = L/2. By substituting x = L/2, the maximum temperature is:

$$ T\left( x \right) = \frac{{V^{2} }}{{8\rho K_{p} }} + T_{s} . $$
(24)

The maximum temperature varies proportionally to the square of the applied voltage and inversely proportional to the density and thermal conductivity.

Appendix B

2.1 Mechanical model

In this section, deflection of a simplified model of a u-shape thermal actuator is examined. Figure 18 shows the model of the single beam structure. When the thermal gradient perpendicular to the beam axis is imposed, the heat transfer by conduction in a plane beam is given as (Seng et al. 2009):

$$ T\left( x \right) = (T - Ts) \, x/L + Ts. $$
(25)

By imposing the temperature profile, we get

$$ T\left( y \right) = \frac{{T_{h} - T_{c} }}{h}y + \frac{{T_{h} + T_{c} }}{2}. $$
(26)

where T c is the temperature of the bottom of the beam (cold arm temperature) and T h is the temperature of the top of the beam (hot arm temperature). Equation 25 shows that the top of the beam mimics the hot arm of the microactuator while the bottom of the beam mimics the cold arm of the microactuator.

By denoting the deflection in the x–y plane by v(x), the steady state deflection of an elastic beam is (Seng et al. 2009):

$$ \frac{{\partial^{2} }}{{\partial x^{2} }}\left( {\frac{{EI\partial^{2} V}}{{\partial x^{2} }}} \right) + P\frac{{\partial^{2} v}}{{\partial x^{2} }} = F, $$
(27)

where E is the Young’s modulus of the beam, I is the moment of inertia, v is the deflection of the beam, P is the load of the beam and F is the applied force. If we assume there is no motion of the beam in the y–z plane then the applied force can be written as:

$$ F = P\left( x \right) - \frac{{\partial^{2} M_{Tz} }}{{\partial x^{2} }}. $$
(28)

Assuming that the load P (x) i.e. the contribution from the effects other than thermal stress is identically zero. The term M Tz is computed by:

$$ M_{Tz} = \mathop \int \limits_{A}^{{}} \alpha ETydA, $$
(29)

where M Tz is the bending moment and α is the thermal expansion coefficient. From Eq. 29, the integral is an area integral over the cross section of the beam. Using the assumption regarding the temperature and assuming that α and E are constant, expression becomes:

$$ M_{Tz} = \frac{{\alpha Ewh^{2} }}{12}(T_{h} - T_{c} ). $$
(30)

The assumption that there is no motion in the y–z plane is required to assume the analogous quantity M Ty defined as:

$$ M_{Ty} = \mathop \int \limits_{A}^{{}} \alpha ETydz. $$
(31)

This equation is defined to be identically zero. This follows from the assumed temperature field. The expression for M Tz implies that:

$$ \frac{{\partial^{2} M_{Tz} }}{{\partial x^{2} }} = 0. $$
(32)

Substituting Eq. 31 into Eq. 27 gives F = 0. Therefore, both equations reduced to:

$$ EI\frac{{\partial^{4} v}}{{\partial x^{4} }} + P\frac{{\partial^{2} v}}{{\partial x^{2} }} = 0. $$
(33)

Let us further assume that P = 0 and hence simplify to:

$$ \frac{{\partial^{4} v}}{{\partial x^{4} }} = 0. $$
(34)

Assuming the left end of the beam is held fixed or anchored, the boundary conditions can be applied:

$$ v\left( 0 \right) = \frac{\partial v}{\partial x}(0) = 0. $$
(35)

Assume the right end of the beam is free or unsupported. In the presence of thermal stresses, the boundary conditions at the free end of a beam are (Seng et al. 2009):

$$ EI\frac{{\partial^{2} v}}{{\partial x^{2} }}(L) = - M_{Tz} , $$
(36)
$$ EI\frac{{\partial^{3} v}}{{\partial x^{3} }}\left( L \right) + P\frac{\partial v}{\partial x} = - \frac{{\partial M_{Tz} }}{\partial x}. $$
(37)

Using Eq. 30, this can be reduced to:

$$ EI\frac{{\partial^{2} v}}{{\partial x^{2} }}\left( L \right) = - \frac{{\alpha Ewh^{2} }}{12}(T_{h} - T_{c} ). $$
(38)

The differentiation of above equation gives:

$$ \frac{{\partial^{3} v}}{{\partial x^{3} }}\left( L \right) = 0. $$
(39)

Taking the integration of the equation below and applying the boundary condition yields the beam deflection:

$$ EI\frac{{\partial^{2} v}}{{\partial x^{2} }}\left( x \right) = - \frac{{\alpha Ewh^{2} }}{12}(T_{h} - T_{c} ), $$
(40)
$$ \frac{{\partial^{2} v}}{{\partial x^{2} }}\left( x \right) = - \frac{{\alpha wh^{2} }}{12I}(T_{h} - T_{c} ). $$
(41)

Finally, the deflection in Eq. 40 is obtained as:

$$ v\left( x \right) = - \frac{{\alpha wh^{2} }}{12I}(T_{h} - T_{c} )x^{2} , $$
(42)

where I is defined as:

$$ I = \mathop \int \limits_{A}^{{}} y^{2} dA = \frac{{wh^{3} }}{12}. $$
(43)

Finally, the deflection in Eq. 40 is obtained as:

$$ v\left( x \right) = - \frac{\alpha }{2h}(T_{h} - T_{c} )x^{2} , $$
(44)
$$ \begin{aligned} h = & - \left( {\frac{{L_{ch} }}{{L_{h} }}} \right)\left( {W_{h} + W_{c} + L_{g} } \right) + \left( {\frac{{L_{c} - L_{ch} }}{{L_{h} }}} \right)\left( {W_{h} + W_{c} } \right) \\ + \left( {\frac{{L_{f} }}{{L_{h} }}} \right)\left( {W_{f} + W_{h} } \right). \\ \end{aligned} $$
(45)

where L ch is the length of the cold hot arm linkage, L h is the length of hot arm, L c is the length of cold arm, W h is the width of hot arm, W c is the width of cold arm, W f is the width of flexure, L g is the distance between hot and cold arm, and L f is the length of flexure.

Appendix C

3.1 Force model

For a single beam, when the temperature is different from the ambient temperature, it undergoes either expansion or compression. The change of the beam length can be calculated using:

$$ \Delta L = \mathop \int \limits_{0}^{L} \alpha \left( T \right)T\left( x \right)dx, $$
(46)

where α(T) is the thermal expansion coefficient. If we assume α(T) is constant for various temperatures, the equation of thermal expansion can be simplified to:

$$ \Delta L = \alpha \mathop \int \limits_{0}^{L} T\left( x \right)dx. $$
(47)

Putting T(x) from Eq. 23 into above equation and solving it yields:

$$ \Delta L = L\left[ {\frac{{V^{2} }}{{12\rho K_{p} }} + T_{s} } \right]. $$
(48)

Once the temperature distribution for each beam is known, ΔL and an equivalent force generated due to thermal expansion can be found using the following Eq. 49:

$$ F = AE\frac{\Delta L}{L}. $$
(49)

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Riaz, K., Iqbal, A., Mian, M.U. et al. Active gap reduction in comb drive of three axes capacitive micro accelerometer for enhancing sense capacitance and sensitivity. Microsyst Technol 21, 1301–1312 (2015). https://doi.org/10.1007/s00542-014-2377-3

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s00542-014-2377-3

Keywords

Navigation