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Dynamic characterization of bulk micromachined accelerometer using laser doppler vibrometer (LDV)

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Abstract

The paper reports dynamic characterization and performance evaluation of two out-of-plane (Z-axis) bulk micromachined piezoresistive accelerometers. Symmetric quad-beam structured bulk micromachined accelerometers with two different variations in beam length, i.e. 500 and 700 µm, keeping other parameters same, were fabricated using CMOS compatible 25 wt%. TMAH wet etching and deep reactive ion etching. Simulations for dynamic characterization were carried out using CoventorWare® and MEMS+® with MATLAB®. Furthermore, this paper reveals how a scanning laser doppler vibrometer, an instrument designed to measure vibrations of structures or objects, can be used in a non-traditional fashion to characterize MEMS accelerometer. From the frequency and transient response analysis, mode shape and resonant frequency, bandwidth, quality factor and settling time were evaluated experimentally. A comparison of simulated and experimental results is also presented, and the results are found to be in close agreement with each other.

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Acknowledgments

Authors would like to acknowledge the generous support of the Director, CSIR-CEERI, Pilani. The authors would also like to thank all the scientific and technical members of MEMS and Microsensors Group at CSIR-CEERI, Pilani. The authors acknowledge the help provided by the Centre for Nano Science and Engineering (CeNSE) at the Indian Institute of Science (IISc), Bangalore for providing the LDV characterization facility for mechanical characterization, funded by Department of Information Technology, Govt. of India. The financial support by CSIR, New Delhi, through PSC-0201: MicroSenSys project is gratefully acknowledged to carry out the research work.

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Correspondence to R. Mukhiya.

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Sharma, A., Mukhiya, R., Santosh Kumar, S. et al. Dynamic characterization of bulk micromachined accelerometer using laser doppler vibrometer (LDV). Microsyst Technol 21, 2221–2232 (2015). https://doi.org/10.1007/s00542-014-2316-3

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  • DOI: https://doi.org/10.1007/s00542-014-2316-3

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