Abstract
This paper presents the application of the powder blasting technique for the fabrication of a low temperature co-fired ceramic package that is to host an optical sensor device. The package consists of several layers of green tape ceramic featuring aperture sizes ranging from 3 to 0.1 mm in diameter. These layers have been patterned using fine alumina particles of 9 μm in diameter in combination with an electroplated nickel mask coated with a protective layer. The latter is based on a photosensitive material laid down on top of the metallic surface, exposed and developed to free the metal apertures from the coating. The results show that the wide range of apertures size present in the mask can be used to machine the green ceramic. The quality of the structures is smooth and vias shapes are perfectly circular. These results were obtained at 50 psi with a flow rate of 0.20 g/s for a distance of 20 mm between the tip of the nozzle and the substrate.
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References
Gangqiang W, Folk EC, Barlow F, Aicha E (2006) Fabrication of microvias for multilayer LTCC substrates. IEEE Trans Electron Packag Manuf 29:32–41
Goldbach M, Axthelm H, Keusgen M (2006) LTCC-based microchips for the electrochemical detection of phenolic compounds. Sens Actuators B Chem 120:346–351
Golonka LJ, Roguszczak H, Zawada T, Radojewski J, Grabowska I, Chudy M, Dybko A, Brzozka Z, Stadnik D (2005) LTCC based microfluidic system with optical detection. Sens Actuators B Chem 111–112:396–402
Kulke R, Rittweger M, Uhlig P, Günner C (2001) LTCC—multilayer ceramic for sensor and wireless applications. Produktion von Leiterplatten und Systemen. Eugen G Leuze, Verlag
Kulke R, Günner C, Holzwarth S, Kassner J, Lauer A, Rittweger M, Uhlig P, Weigand P (2005) 24 GHz radar sensor integrates patch antenna and frontend module in single multilayer LTCC substrate. In: Proceedings of the European microelectronics packaging conference-EMPC, Bruges
Lacrotte Y, Amalou F, Yu W, Desmulliez MPY (2009) Micro-patterning of green tape ceramics using powder-blasting for LTCC manufacturing. IMAPS-ACerS CICMT, Denver
Lacrotte Y, Kay RW, Desmuliez MPY (2011). Manufacture of a 3-D package using low temperature co-fired ceramic technology. In: Proceedings of the 18th European microelectronics and packaging conference—EMPC, Brighton
Marksteiner S, Handtmann M, Timme HJ, Aigner R, Welzer R, Portmann J, Bauernschmitt U (2003). A miniature BAW duplexer using flip-chip on LTCC. In: Proceedings of the IEEE symposium on ultrasonics, Honolulu, pp 1794–1797
Pawlowski AG, Sayah A, Gijs MAM (2005) Precision poly-(dimethyl siloxane) masking technology for high-resolution powder blasting. J Microelectromech Syst 14:619–623
Powell RC, Gray AK, Coleman TA (2007). Material supply system and method. United States patent application
Rhim S, Shin S, Joo B, Oh S (2006) Burr formation during micro via-hole punching process of ceramic and PET double layer sheet. Int J Adv Manuf Technol 30:227–232
Sayah A, Parashar VK, Pawlowski AG, Gijs MAM (2005) Elastomer mask for powder blasting microfabrication. Sens Actuators A 125:84–90
Slikkerveer PJ, van Dongen MHA, Touwslager FJ (1999) Erosion of elastomeric protective coatings. Wear 236:189–198
Wensink H, Berenschot JW, Jansen HV, Elwenspoek MC (2000). High resolution powder blast micromachining. In: Proceedings of the 13th annual international conference on micro electro mechanical systems, 2000
Wensink H, Jansen HV, Berenschot JW, Elwenspoek MC (2000b) Mask materials for powder blasting. J Micromech Microeng 10:175–181
Acknowledgments
The authors of this article acknowledge the financial support of the EPSRC-funded Engineering Doctorate in Photonics, the financial contribution of the Company Renishaw as well as the support of the EPSRC funded project Smart Microsystems, which is one of the two flagship projects of the Innovative electronics Manufacturing Research Centre (IeMRC).
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Lacrotte, Y., Carr, J.P., Kay, R.W. et al. Fabrication of a low temperature co-fired ceramic package using powder blasting technology. Microsyst Technol 19, 791–799 (2013). https://doi.org/10.1007/s00542-013-1801-4
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DOI: https://doi.org/10.1007/s00542-013-1801-4