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Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation

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Abstract

This paper presents the use of micro-particle imaging velocimetry (micro-PIV) to analyse fluid flow and hence ion replenishment in PCB micro-via during the electroplating process. The cross section of a PCB via is fabricated in PMMA to allow optical access to the sample. Fluid flow within two 1:1 aspect ratio blind micro-vias, one with straight side walls and the other with tapered side walls were compared. Flow is also analysed in a 1:1 aspect ratio through via. Flow rates measured using micro-PIV are used to validate simulated flow models. The results show that there are increased flow rates within the blind via with tapered side walls. This goes some way to explaining the improved electroplating results obtained in industry when tapered vias are used. Initial experimental results using megasonic streaming to remove bubbles from blind micro-via and promote ion transportation within high aspect ratio PCB micro-via to enhance electrodeposition are also reported.

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References

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Acknowledgments

The authors would like to acknowledge the Engineering and Physical Sciences Research Council (EPSRC) for their financial support through the grant ASPECT supported by the Innovative Research Manufacturing Research Centre (IMRC) at Heriot-Watt University, and the IeMRC funded project SMART MICROSYSTEMS. The authors would also like to thanks Tim Ryan and Phil Summersgill from Epigem Ltd for their help with the manufacturing of the microfluidic samples.

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Authors and Affiliations

  1. MicroSystems Engineering Centre (MISEC), School of Engineering and Physical Sciences, Heriot-Watt University, Edinburgh, EH14 4AS, UK

    S. Costello, D. Flynn, R. W. Kay & M. P. Y. Desmulliez

  2. School of Computing and Mathematical Sciences, University of Greenwich, Old Royal Naval College, Park Row, London, SE10 9LS, UK

    N. Strusevich, M. K. Patel & C. Bailey

  3. Merlin Circuit Technology Ltd., Hawarden Industrial Park, Manor Lane, Deeside, CH5 3QZ, UK

    D. Price

  4. School of Chemistry, University of Edinburgh, Joseph Black Building, Edinburgh, EH9 3JF, UK

    M. Bennet & A. C. Jones

Authors
  1. S. Costello
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  2. N. Strusevich
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  3. D. Flynn
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  4. R. W. Kay
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  5. M. K. Patel
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  6. C. Bailey
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  7. D. Price
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  8. M. Bennet
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  9. A. C. Jones
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  10. M. P. Y. Desmulliez
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Corresponding author

Correspondence to N. Strusevich.

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Costello, S., Strusevich, N., Flynn, D. et al. Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. Microsyst Technol 19, 783–790 (2013). https://doi.org/10.1007/s00542-013-1746-7

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  • DOI: https://doi.org/10.1007/s00542-013-1746-7

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